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37. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VI
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VI
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-1395-3
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38. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume V
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume V
Author 
Sha, Aimin. editor. Chen, Hao. editor. Wei, Baoquan. editor. Xie, Wenhao. editor. Chen, Songsong. editor.
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https://doi.org/10.1007/978-981-96-1852-1
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39. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VI
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VI
Author 
Sha, Aimin. editor. Zhang, Li. editor. (orcid)0000-0003-4277-0591 Peng, Jishen. editor. Yan, XIaoheng. editor. Rong, Cancan. editor. (orcid)0000-0002-8836-0806
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https://doi.org/10.1007/978-981-96-1856-9
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40. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
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Lienig, Jens. author. (orcid)0000-0002-2140-4587 Rothe, Susann. author. Thiele, Matthias. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-80023-8
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41. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VII
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VII
Author 
Sha, Aimin. editor. Liu, Zhigang. editor. Wang, Xiaojun. editor. Xiao, Qian. editor. Zang, Yiming. editor.
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https://doi.org/10.1007/978-981-96-1864-4
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42. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume III
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume III
Author 
Jia, Limin. editor. Li, Yong. editor. (orcid)0000-0002-1183-5359 Xu, Xianfeng. editor. Zang, Yiming. editor. Zhang, Longlong. editor.
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https://doi.org/10.1007/978-981-96-2046-3
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43. 
Cover image for Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Author 
Siarry, Patrick. editor. (orcid)0000-0002-5722-4115 Jabbar, M. A. editor. Cheung, Simon King Sing. editor. (orcid)0000-0002-7323-0961 Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2409-6
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44. 
Cover image for SOC-Based Solutions in Emerging Application Domains
SOC-Based Solutions in Emerging Application Domains
Author 
Chakravarthi, Veena S. author. (orcid)0000-0002-8703-2376 Koteshwar, Shivananda R. author. (orcid)0000-0003-4299-4069 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-85044-8
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45. 
Cover image for Fully-Integrated Low-Dropout Regulators
Fully-Integrated Low-Dropout Regulators
Author 
Mao, Xiangyu. author. (orcid)0000-0001-6530-8311 Lu, Yan. author. Martins, Rui P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-84916-9
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46. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4787-3
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47. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume IX
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume IX
Author 
Yang, Qingxin. editor. Zhu, Chunbo. editor. Xia, Chenyang. editor. Li, Yang. editor. Luo, Zhichao. editor.
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https://doi.org/10.1007/978-981-96-4800-9
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48. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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