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37. 
Cover image for More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
Author 
Topaloglu, Rasit O. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2163-8
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38. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
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Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07611-9
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39. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9176-7
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