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37. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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38. 
Cover image for Smart Homes Design, Implementation and Issues
Smart Homes Design, Implementation and Issues
Author 
Suryadevara, Nagender Kumar. author. Mukhopadhyay, Subhas Chandra. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-13557-1
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39. 
Cover image for Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Author 
Maharatna, Koushik. editor. Dalapati, Goutam Kumar. editor. Banerjee, P K. editor. Mallick, Amiya Kumar. editor. Mukherjee, Moumita. editor.
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https://doi.org/10.1007/978-81-322-2274-3
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40. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
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Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06764-3
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