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37. 
Cover image for Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Author 
Seebauer, Edmund G. author. Kratzer, Meredith C. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-84882-059-3
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38. 
Cover image for Gallium Nitride Processing for Electronics, Sensors and Spintronics
Gallium Nitride Processing for Electronics, Sensors and Spintronics
Author 
Pearton, Stephen J. author. Abernathy, Cammy R. author. Ren, Fan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-359-0
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39. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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40. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27512-8
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41. 
Cover image for Piezoelectricity Evolution and Future of a Technology
Piezoelectricity Evolution and Future of a Technology
Author 
Heywang, Walter. author. Lubitz, Karl. author. Wersing, Wolfram. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-68683-5
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42. 
Cover image for Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Author 
Huff, Howard R. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-74559-4
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43. 
Cover image for Gallium Nitride Electronics
Gallium Nitride Electronics
Author 
Quay, Rüdiger. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-71892-5
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44. 
Cover image for Electroceramic-Based MEMS Fabrication-Technology and Applications
Electroceramic-Based MEMS Fabrication-Technology and Applications
Author 
Setter, Nava. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b101200
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45. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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46. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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47. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3627-0
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48. 
Cover image for Printed Flexible Sensors Fabrication, Characterization and Implementation
Printed Flexible Sensors Fabrication, Characterization and Implementation
Author 
Nag, Anindya. author. Mukhopadhyay, Subhas Chandra. author. Kosel, Jurgen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-13765-6
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