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37. 
Cover image for Technology of Quantum Devices
Technology of Quantum Devices
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-1056-1
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38. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
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39. 
Cover image for Electrochemical Nanotechnologies
Electrochemical Nanotechnologies
Author 
Osaka, Tetsuya. editor. Datta, Madhav. editor. Shacham-Diamand, Yosi. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1424-8
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40. 
Cover image for Nanoscale Photonics and Optoelectronics Science and Technology
Nanoscale Photonics and Optoelectronics Science and Technology
Author 
Wang, Zhiming M. editor. Neogi, Arup. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7587-4
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41. 
Cover image for Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Author 
Fortin, Jeffrey. editor. Zribi, Anis. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138612
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42. 
Cover image for More than Moore Creating High Value Micro/Nanoelectronics Systems
More than Moore Creating High Value Micro/Nanoelectronics Systems
Author 
Zhang, Guo Qi. editor. Roosmalen, Alfred. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-75593-9
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43. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78219-5
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44. 
Cover image for Embedded Memories for Nano-Scale VLSIs
Embedded Memories for Nano-Scale VLSIs
Author 
Zhang, Kevin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88497-4
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45. 
Cover image for Copper Interconnect Technology
Copper Interconnect Technology
Author 
Gupta, Tapan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0076-0
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46. 
Cover image for Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Author 
Huff, Howard R. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-74559-4
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47. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-92168-6
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48. 
Cover image for Nanopackaging Nanotechnologies and Electronics Packaging
Nanopackaging Nanotechnologies and Electronics Packaging
Author 
Morris, James E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-47325-3
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