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1. 
Cover image for Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Author 
Kenett, Ron, editor. Swarz, Robert S., editor. Zonnenshain, Avigdor, editor.
Preferred Shelf Number 
TA168 .S8727 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119513957
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2. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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3. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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4. 
Cover image for Real-time embedded systems
Real-time embedded systems
Author 
Wang, Jiacun, 1963- author.
Preferred Shelf Number 
TK7895 .E42
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119420712
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5. 
Cover image for Nanoelectronics : materials, devices, applications
Nanoelectronics : materials, devices, applications
Author 
Puers, R., editor.
Preferred Shelf Number 
TK7874.84
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527800728
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6. 
Cover image for Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO : Application to Displays
Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO : Application to Displays
Author 
Yamazaki, Shunpei, editor. Tsutsui, Tetsuo, editor.
Preferred Shelf Number 
TK7871.85
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119247395
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7. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09111-2
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8. 
Cover image for CMOS Test and Evaluation A Physical Perspective
CMOS Test and Evaluation A Physical Perspective
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1349-7
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9. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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10. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06773-5
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11. 
Cover image for Bias Temperature Instability for Devices and Circuits
Bias Temperature Instability for Devices and Circuits
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-7909-3
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12. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-1761-3
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