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37. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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38. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6348-2
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39. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-14952-8
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40. 
Cover image for Montage in der Leistungselektronik für globale Märkte Design, Konzepte, Strategien
Montage in der Leistungselektronik für globale Märkte Design, Konzepte, Strategien
Author 
Feldmann, Klaus. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-540-87972-5
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41. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-79394-8
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42. 
Cover image for Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Author 
Radetzki, Martin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9714-0
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43. 
Cover image for Precision Manufacturing
Precision Manufacturing
Author 
Dornfeld, David. author. Lee, Dae-Eun. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68208-2
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44. 
Cover image for Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
Author 
Tehranipoor, Mohammad. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74747-7
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45. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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46. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38892-2
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47. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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48. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-310-9
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