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37. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331661.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5052-8
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38. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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39. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-27512-8
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40. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-34237-0
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41. 
Cover image for Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Author 
Pardo, Lorena. author. Ricote, Jesús. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-2875-4
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42. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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43. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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44. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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45. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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46. 
Cover image for Organische Elektronik in Deutschland Bewertung und Empfehlungen Für Die Weiterentwicklung.
Organische Elektronik in Deutschland Bewertung und Empfehlungen Für Die Weiterentwicklung.
Author 
acatech - Deutsche Akademie der Technikwissenschaften. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20461-6
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47. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-236-0
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48. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8164-6
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