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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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2. 
Cover image for Innovative Technologies for Printing and Packaging
Innovative Technologies for Printing and Packaging
Author 
Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. Yan, Shu. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9024-3
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3. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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4. 
Cover image for Packaging yourself : the targeted resume
Packaging yourself : the targeted resume
Author 
Wendleton, Kate, author. Five O'Clock Club (New York, N.Y.), issuing body.
Preferred Shelf Number 
ONLINE(341070.1)
Electronic Access 
Available for Hacettepe University via Gale Virtual Reference Library. Click here to access
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5. 
Cover image for Food packaging : principles and practice
Food packaging : principles and practice
Author 
Robertson, Gordon L.
Preferred Shelf Number 
TP374 R63 2013
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6. 
Cover image for Food packaging procedures, management, and trends
Food packaging procedures, management, and trends
Author 
Kontominas, Michael, editor of compilation.
Preferred Shelf Number 
ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=535197
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7. 
Cover image for Packaging technology fundamentals, materials and processes
Packaging technology fundamentals, materials and processes
Author 
Emblem, Anne. Emblem, Henry.
Preferred Shelf Number 
ONLINE(313043.1)
Electronic Access 
Knovel http://app.knovel.com/hotlink/toc/id:kpPTFMP001/packaging-technology
Knovel http://app.knovel.com/web/toc.v/cid:kpPTFMP001
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8. 
Cover image for Modified atmosphere and active packaging technologies
Modified atmosphere and active packaging technologies
Author 
Arvanitoyannis, Ioannis.
Preferred Shelf Number 
TP374 .M59 2012
Electronic Access 
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9. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
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10. 
Cover image for Food and beverage packaging technology
Food and beverage packaging technology
Author 
Kirwan, Mark J.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781444392180
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=675208
ebrary http://site.ebrary.com/id/10510323
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11. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
Preferred Shelf Number 
TK7870.15 .J56 2011
Electronic Access 
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12. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0984-8
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