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1. 
Cover image for Advances in Engineering Research and Application Proceedings of the International Conference on Engineering Research and Applications, ICERA 2024, Volume 2
Advances in Engineering Research and Application Proceedings of the International Conference on Engineering Research and Applications, ICERA 2024, Volume 2
Author 
Nguyen, Duy Cuong. editor. Hai, Do Trung. editor. Vu, Ngoc Pi. editor. Long, Banh Tien. editor. Puta, Horst. editor.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-032-03859-3
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2. 
Cover image for Open RAN : technology and ecosystem
Open RAN : technology and ecosystem
Author 
Yanover, Vladimir, author.
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TK5103.2 .Y36 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394241170
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3. 
Cover image for Network coding for engineers
Network coding for engineers
Author 
Médard, Muriel, author. Vasudevan, Vipindev Adat, author. Pedersen, Morten Videbaek, author. Duffy, Ken R., author.
Preferred Shelf Number 
TK5102.92 .M43 2025
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394217304
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4. 
Cover image for Electric Power Robots Modeling, Control, and Applications
Electric Power Robots Modeling, Control, and Applications
Author 
Wang, Yaonan. author. (orcid)0000-0002-0519-6458 Chen, Yanjie. author. (orcid)0000-0001-9750-9177 Zhong, Hang. author. Liang, Jiacheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2512-3
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5. 
Cover image for Emerging Research in Intelligent Systems Proceedings of the CIT 2024 - Volume 1
Emerging Research in Intelligent Systems Proceedings of the CIT 2024 - Volume 1
Author 
Olmedo Cifuentes, Gonzalo Fernando. editor. (orcid)0000-0002-6205-1685 Arcos Avilés, Diego Gustavo. editor. (orcid)0000-0002-1511-1614 Lara Padilla, Hernán Vinicio. editor. (orcid)0000-0002-0085-1820 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-87704-9
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6. 
Cover image for The Mass of a Photon Side Notes on Electrical Engineering
The Mass of a Photon Side Notes on Electrical Engineering
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von Stackelberg, Josef. author. (orcid)0000-0002-8875-9403 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-49408-7
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7. 
Cover image for Alkaline anion exchange membranes for fuel cells : from tailored materials to novel applications
Alkaline anion exchange membranes for fuel cells : from tailored materials to novel applications
Author 
Thomas, Jince, editor. Schechter, Alex, editor. Grynszpan, Flavio, editor. Francis, Bejoy, editor. Thomas, Sabu, editor.
Preferred Shelf Number 
TK2931
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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527837588
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8. 
Cover image for Emerging Research in Intelligent Systems Proceedings of the CIT 2023 Volume 1
Emerging Research in Intelligent Systems Proceedings of the CIT 2023 Volume 1
Author 
Olmedo Cifuentes, Gonzalo Fernando. editor. Arcos Avilés, Diego Gustavo. editor. (orcid)0000-0002-1511-1614 Lara Padilla, Hernán Vinicio. editor. (orcid)0000-0002-0085-1820 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-52255-0
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9. 
Cover image for 2nd International Congress of Electrical and Computer Engineering
2nd International Congress of Electrical and Computer Engineering
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Seyman, Muhammet Nuri. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-52760-9
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10. 
Cover image for Emerging Research in Intelligent Systems Proceedings of the CIT 2023 Volume 2
Emerging Research in Intelligent Systems Proceedings of the CIT 2023 Volume 2
Author 
Olmedo Cifuentes, Gonzalo Fernando. editor. Arcos Avilés, Diego Gustavo. editor. (orcid)0000-0002-1511-1614 Lara Padilla, Hernán Vinicio. editor. (orcid)0000-0002-0085-1820 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-52258-1
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11. 
Cover image for Smart Transportation and Green Mobility Safety Green Mobility
Smart Transportation and Green Mobility Safety Green Mobility
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Wang, Wuhong. editor. Jin, Lisheng. editor. (orcid)0000-0002-3086-1333 Tan, Haiqiu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2443-7
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12. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2140-5
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