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505. 
Cover image for Nyquist AD Converters, Sensor Interfaces, and Robustness Advances in Analog Circuit Design, 2012
Nyquist AD Converters, Sensor Interfaces, and Robustness Advances in Analog Circuit Design, 2012
Author 
van Roermund, Arthur H.M. editor. Baschirotto, Andrea. editor. Steyaert, Michiel. editor. SpringerLink (Online service)
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ONLINE(331543.1)
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http://dx.doi.org/10.1007/978-1-4614-4587-6
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506. 
Cover image for TOF Range-Imaging Cameras
TOF Range-Imaging Cameras
Author 
Remondino, Fabio. editor. Stoppa, David. editor. SpringerLink (Online service)
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ONLINE(333154.1)
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http://dx.doi.org/10.1007/978-3-642-27523-4
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507. 
Cover image for Decreasing Fuel Consumption and Exhaust Gas Emissions in Transportation Sensing, Control and Reduction of Emissions
Decreasing Fuel Consumption and Exhaust Gas Emissions in Transportation Sensing, Control and Reduction of Emissions
Author 
Palocz-Andresen, Michael. author. SpringerLink (Online service)
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ONLINE(333053.1)
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http://dx.doi.org/10.1007/978-3-642-11976-7
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508. 
Cover image for ESD basics from semiconductor manufacturing to use
ESD basics from semiconductor manufacturing to use
Author 
Voldman, Steven H. Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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ebrary http://site.ebrary.com/id/10602092
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509. 
Cover image for Telecommunication networks
Telecommunication networks
Author 
Iannone, Eugenio., author.
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TK5105 .I247 2012
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510. 
Cover image for Fundamentals and applications of ultrasonic waves
Fundamentals and applications of ultrasonic waves
Author 
Cheeke, J. David N., author.
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QC244 .C47 2012
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511. 
Cover image for Integrated microsystems : electronics, photonics, and biotechnology
Integrated microsystems : electronics, photonics, and biotechnology
Author 
Iniewski, Krzysztof.
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TK7875 .I48 2012
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512. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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513. 
Cover image for CMOS biomicrosystems where electronics meet biology
CMOS biomicrosystems where electronics meet biology
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Iniewski, Krzysztof, 1960- Wiley InterScience (Online service)
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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5988887
IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=5988887
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514. 
Cover image for Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan
Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan
Author 
International Symposium on Silicon Science (5th : 2009 : Kiryū-shi, Japan) Hanaizumi, Osamu. Unno, Masafumi. Gunma Daigaku. International Education and Research Center for Silicon Science. Gunma Daigaku. Advanced Technology Research Center.
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515. 
Cover image for Design for embedded image processing on FPGAs
Design for embedded image processing on FPGAs
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Bailey, Donald G. (Donald Graeme), 1962-
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IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6016259
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516. 
Cover image for Digital holography for MEMS and microsystem metrology
Digital holography for MEMS and microsystem metrology
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Asundi, Anand.
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John Wiley http://dx.doi.org/10.1002/9781119997290
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