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49. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7636-0
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50. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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51. 
Cover image for Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Author 
Qin, Jiahu. author. Wan, Yanni. author. Li, Fangyuan. author. Kang, Yu. author. Fu, Weiming. author.
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https://doi.org/10.1007/978-981-19-8594-2
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52. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0451-8
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53. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0915-5
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54. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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55. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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56. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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57. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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58. 
Cover image for Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Author 
Manetakis, Konstantinos. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-31086-7
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59. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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60. 
Cover image for Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Author 
Qian, Zhihong. editor. Jabbar, M.A. editor. Cheung, Simon K. S. editor. Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-3951-0
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