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Author

Jaeger, Richard C.

(5)

SpringerLink (Online service)

(5)

Wiley InterScience (Online service)

(4)

Blalock, Travis N.

(3)

Brown, William D., 1943-

(3)

Chen, Wai-Kai, 1936-

(3)

Brewer, Joe (Joe E.)

(2)

IEEE Circuits and Systems Society.

(2)

IEEE Solid-State Circuits Society.

(2)

Makabe, T. (Toshiaki), author.

(2)

Marcus, P. (Philippe), 1953-

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Ahsan, Tanweer, editor.

(1)

American Chemical Society. Division of Polymeric Materials: Science and Engineering.

(1)

Andreou, Andreas G.

(1)

(1)

Baker, R. Jacob, 1964-

(1)

Ballantyne, J. P.

(1)

Bhushan, Manjul. author.

(1)

Blalock, Travis N., ort. yaz.

(1)

Brand, Oliver. author.

(1)

Brewer, George Raymond, 1922-

(1)

Cheeke, J. David N., author.

(1)

Chen, Andrea., author.

(1)

Chen, Jing, 1974-

(1)

Choudhary, Vikas.

(1)

Components, Packaging & Manufacturing Technology Society.

(1)

(1)

Elst, Günter. editor.

(1)

Fleetwood, D. M. (Dan M.)

(1)

(1)

(1)

Goel, Sanket, editor.

(1)

Gutmann, Ronald J.

(1)

Guttman, Andras.

(1)

Hanke, Randolf. editor.

(1)

Heller, Michael J.

(1)

Heuberger, Albert. editor.

(1)

Hilleringmann, Ulrich. author.

(1)

Horie, Kazuyuki, 1941-

(1)

Hurst, S. L. (Stanley Leonard), author.

(1)

Iniewski, Krzysztof.

(1)

Ito, Hiroshi, ed.

(1)

Jim�enez, J. (Juan)

(1)

Jin, Yufeng., author.

(1)

John Wiley & Sons.

(1)

Karimi-Ghartemani, Masoud, author.

(1)

Kaya, İbrahim.

(1)

Ketchen, Mark B. author.

(1)

(1)

Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group.

(1)

(1)

Liu, S. (Sheng), 1963-

(1)

(1)

Liu, Yong, 1962-

(1)

(1)

(1)

Madkour, Loutfy H. (Loutfy Hamid), author.

(1)

Mayer, Michael. author.

(1)

Mittal, K. L., 1945- editor.

(1)

Mittal, Kash L., 1945- editor.

(1)

(1)

Oklobdzija, Vojin G.

(1)

Osaka, Tetsuya, 1945-

(1)

Pantelides, Sokrates T.

(1)

Pecht, Michael.

(1)

Pereira, Oswyn.

(1)

(1)

Petrovic, Z., author.

(1)

Puttlitz, Karl J.

(1)

Ramaswami, Sesh.

(1)

(1)

Rossnagel, Stephen M.

(1)

Ruska, W. Scot.

(1)

Schrimpf, Ronald Donald.

(1)

Schultze, J. W. (Joachim Walter)

(1)

Schwizer, Jürg. author.

(1)

Sedra, Adel S., author.

(1)

(1)

Smith, Kenneth C. (Kenneth Carless), author.

(1)

Stalter, Kathleen A.

(1)

Steigerwald, Joseph M.

(1)

Strong, Alvin Wayne, 1946-

(1)

Suganuma, Katsuaki, editor.

(1)

Sánchez-Sinencio, Edgar.

(1)

Tagawa, Seichi, ed.

(1)

Taylor and Francis.

(1)

(1)

Voyiadjis, George Z. editor.

(1)

Wang, Zhiping, 1962- Oct. 6-

(1)

Waynant, Ronald W.

(1)

(1)

(1)

Yang, Edward S.

(1)

Özerdem, Mehmet Siraç, çeviri editörü

(1)

Language

(48)

(2)

Publication Date

-

(8)

(4)

(4)

(3)

(3)

(3)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Microelectronic packaging.

(11)

Electronic books.

(9)

Integrated circuits -- Design and construction.

(6)

Semiconductors -- Design and construction.

(5)

Electronic circuits.

(4)

Microelectronics.

(4)

Nanotechnology.

(4)

Electronic circuit design.

(3)

(3)

Microelectronics -- Materials.

(3)

Mikroelektronik.

(3)

Chemical mechanical planarization.

(2)

Corrosion and anti-corrosives.

(2)

Electronic packaging.

(2)

Low voltage integrated circuits.

(2)

Microelectromechanical systems.

(2)

MİKROELEKTRONİK.

(2)

Optical materials.

(2)

Optoelectronic devices.

(2)

Plasma engineering.

(2)

Systems engineering.

(2)

İNTEGRE DEVRELER -- ÇİZİM VE YAPIM.

(2)

Adhesion -- Congresses.

(1)

(1)

Adhesive joints.

(1)

(1)

Appareil électronique.

(1)

(1)

Building materials.

(1)

CMOS (Circuit intégré)

(1)

CMOS-Schaltung.

(1)

Carbon composites -- Industrial applications.

(1)

Carbon composites.

(1)

Ceramic materials.

(1)

(1)

(1)

Chip scale packaging.

(1)

Circuit intégré à faible consommation.

(1)

Circuit intégré à très grande échelle.

(1)

Circuit logique.

(1)

Circuit électronique.

(1)

Classical Mechanics.

(1)

Coatings -- Congresses.

(1)

(1)

Computer network architectures.

(1)

Computer science.

(1)

DNA microarrays.

(1)

Dispositif optoélectronique.

(1)

Electric connectors.

(1)

Electric filters.

(1)

Electric power systems -- Equipment and supplies.

(1)

Electrical engineering -- Computer-aided design.

(1)

Electronic Circuits and Systems.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic apparatus and appliances.

(1)

Electronics and Microelectronics, Instrumentation.

(1)

Elektronenstrahllithographie.

(1)

Elektronik devreler.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

(1)

Environmental protection.

(1)

(1)

Flash memories (Computers)

(1)

Frequency synthesizers.

(1)

Green products.

(1)

Grinding and polishing.

(1)

High performance processors -- Design and construction.

(1)

High power lasers.

(1)

ISI -- İLETİM.

(1)

Integrated circuits -- Defects.

(1)

Integrated circuits -- Very large scale integration -- Computer-aided design.

(1)

Integrated circuits -- Very large scale integration -- Design and construction -- Textbooks.

(1)

Integrated circuits -- Very large scale integration.

(1)

Integrated circuits industry.

(1)

Lithography, Electron beam.

(1)

Logic circuits.

(1)

MIKROELEKTRONIK.

(1)

Mechanics, Applied.

(1)

(1)

Metal oxide semiconductor field-effect transistors -- Testing.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Metal oxide semiconductors, Complementary -- Design and construction.

(1)

Metal oxide semiconductors, Complementary -- Reliability.

(1)

Metal oxide semiconductors, Complementary.

(1)

Microelectronic packaging -- Materials.

(1)

Microelectronic packaging -- Simulation methods.

(1)

Microelectronic.

(1)

Microelectronics -- Materials -- Congresses.

(1)

Microelectronics -- Materials -- Testing.

(1)

Microprogramming.

(1)

Mikroelektronik -- Maddele -- Kongreler.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Multichip modules (Microelectronics)

(1)

Mémoire à semiconducteurs.

(1)

Nanobiotechnology -- Materials.

(1)

Nanocomposites (Materials)

(1)

Nanocomposites (Materials) -- Industrial applications.

(1)

Nanoelectronics.

(1)

(1)

Nanostructured materials.

(1)

Passive components.

(1)

Phase-locked loops.

(1)

Photoluminescence.

(1)

(1)

Polymers -- Congresses.

(1)

Power electronics.

(1)

Printed circuits -- Equipment and supplies.

(1)

(1)

SCIENCE / Applied Sciences

(1)

SCIENCE / Chemistry / Clinical

(1)

Schaltungsentwurf.

(1)

Semiconductor lasers.

(1)

Semiconductor storage devices.

(1)

Semiconductors.

(1)

Signal processing.

(1)

Software engineering.

(1)

Solder and soldering.

(1)

Solid Mechanics.

(1)

(1)

Strains and stresses -- Measurement.

(1)

Structural Materials.

(1)

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Digital.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.

(1)

TECHNOLOGY & ENGINEERING / Microwaves

(1)

TECHNOLOGY / Electronics / General

(1)

TECHNOLOGY / Electronics / Microelectronics

(1)

Telecommunication -- Equipment and supplies.

(1)

Telecommunication -- Technological innovations.

(1)

Thin films -- Computer simulation -- Congresses.

(1)

Thin films -- Congresses.

(1)

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Three-dimensional integrated circuits.

(1)

Timing circuits.

(1)

Ultrasonic waves -- Industrial applications.

(1)

Ultrasonic waves.

(1)

Very high speed integrated circuits.

(1)

Wide gap semiconductors.

(1)

YARIİLETKENLER -- ÇİZİM VE YAPIM.

(1)

YARIİLETKENLER.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Taylor Francis E-Book Collection

Library

Beytepe Library

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1.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

Format:

Availability

Online Library~1

Available:
Copies:

2.

Cover image for Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Author

Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-

Preferred Shelf Number

TK7870.15 .J56 2011

Electronic Access

Click here to view.

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3.

Cover image for Nanotechnology for telecommunications

Nanotechnology for telecommunications

Nanotechnology for telecommunications

Author

Anwar, Sohail.

Preferred Shelf Number

TK5103 .N36 2010

Electronic Access

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4.

Cover image for Computer aided design and design automation

Computer aided design and design automation

Computer aided design and design automation

Author

Chen, Wai-Kai, 1936-

Preferred Shelf Number

TA174 .C58135 2009

Electronic Access

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5.

Cover image for Advanced electronic packaging

Advanced electronic packaging

Advanced electronic packaging

Author

Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-

Preferred Shelf Number

ONLINE

Format:

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6.

Cover image for IC component sockets

IC component sockets

IC component sockets

Author

Liu, Weifeng. Pecht, Michael. John Wiley & Sons.

Preferred Shelf Number

ONLINE

Electronic Access

John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html

Format:

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7.

Cover image for The circuits and filters handbook

The circuits and filters handbook

The circuits and filters handbook

Author

Chen, Wai-Kai, 1936-

Preferred Shelf Number

TK7867 .C4977 2003

Electronic Access

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8.

Cover image for Design automation, languages, and simulations

Design automation, languages, and simulations

Design automation, languages, and simulations

Author

Chen, Wai-Kai, 1936-

Preferred Shelf Number

TK7874.75 .V572 2003

Electronic Access

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9.

Cover image for Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Author

Marcus, P. (Philippe), 1953-

Preferred Shelf Number

TA462 .C65575 2002

Electronic Access

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10.

Cover image for Integrated microfabricated biodevices : advanced technology for genomics, drug discovery, bioanalysis, and clinical diagnostics

Integrated microfabricated biodevices : advanced technology for genomics, drug discovery, bioanalysis, and clinical diagnostics

Integrated microfabricated biodevices : advanced technology for genomics, drug discovery, bioanalysis, and clinical diagnostics

Author

Heller, Michael J. Guttman, Andras.

Preferred Shelf Number

R857 .B5 I58 2002

Electronic Access

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11.

Cover image for VLSI custom microelectronics : digital, analog, and mixed-signal

VLSI custom microelectronics : digital, analog, and mixed-signal

VLSI custom microelectronics : digital, analog, and mixed-signal

Author

Hurst, S. L. (Stanley Leonard), author.

Preferred Shelf Number

TK7874.75 .H87 1999

Electronic Access

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