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1. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-28912-5
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Cover image for VLSI, Communication and Signal Processing Select Proceedings of the 5th International Conference, VCAS 2022
VLSI, Communication and Signal Processing Select Proceedings of the 5th International Conference, VCAS 2022
Author 
Nagaria, R. K. editor. Tripathi, V. S. editor. Zamarreno, Carlos Ruiz. editor. Prajapati, Yogendra Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0973-5
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Cover image for Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Author 
Biswas, Abhijit. editor. Islam, Aminul. editor. Chaujar, Rishu. editor. Jaksic, Olga. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0412-9
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4. 
Cover image for System on Chip (SOC) Architecture A Practical Approach
System on Chip (SOC) Architecture A Practical Approach
Author 
Chakravarthi, Veena S. author. Koteshwar, Shivananda R. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-36242-2
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5. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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6. 
Cover image for Generalized Principle of Pattern Multiplication and Its Applications
Generalized Principle of Pattern Multiplication and Its Applications
Author 
Geng, Junping. author. Ren, Chaofan. author. Wang, Kun. author. Liu, Erwei. author. Zhang, Jing. author.
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https://doi.org/10.1007/978-981-19-3559-6
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7. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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8. 
Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-08778-3
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9. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09853-6
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10. 
Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4353-9
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11. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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12. 
Cover image for High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
Author 
Abbene, Leonardo. editor. Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20955-0
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