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1. 
Cover image for Muon spin spectroscopy : methods and applications in chemistry and materials science
Muon spin spectroscopy : methods and applications in chemistry and materials science
Author 
Fleming, Donald G., author. McKenzie, Iain, author. Percival, Paul W., author.
Preferred Shelf Number 
QC762 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527806058
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2. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
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3. 
Cover image for Handbook of water pollution
Handbook of water pollution
Author 
Inamuddin, 1980- editor. Altalhi, Tariq, editor. Alrooqi, Arwa, editor.
Preferred Shelf Number 
TD420 .H36 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119904991
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4. 
Cover image for Progress in adhesion and adhesives. Volume 8
Progress in adhesion and adhesives. Volume 8
Author 
Mittal, K. L., 1945- editor.
Preferred Shelf Number 
TA455 .A34 P76 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394238231
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5. 
Cover image for Polymer surface modification to enhance adhesion : techniques and applications
Polymer surface modification to enhance adhesion : techniques and applications
Author 
Netravali, Anil Narayan, 1948- editor. Mittal, K. L., 1945- editor.
Preferred Shelf Number 
QD381.9 .S97 P65 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394231034
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6. 
Cover image for Photovoltaic solar energy : from fundamentals to applications. Volume 2
Photovoltaic solar energy : from fundamentals to applications. Volume 2
Author 
Sark, Wilfried van, editor. Hoex, Bram, editor. Reinders, Angèle, editor. Verlinden, Pierre, editor. Ekins-Daukes, Nicholas J., editor.
Preferred Shelf Number 
TK1087 .P478 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119578826
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7. 
Cover image for Smart materials for science and engineering
Smart materials for science and engineering
Author 
Upēndra Kumār, editor. Sonkar, Piyush Kumar, 1989- editor.
Preferred Shelf Number 
TA418.9 .S62 S53 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394186488
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8. 
Cover image for Computer-supported collaboration : theory and practice
Computer-supported collaboration : theory and practice
Author 
Huang, Weidong, 1968- author.
Preferred Shelf Number 
QA76.9 .A94 H83 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119719830
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9. 
Cover image for Soil Behavior and Characterization of Geomaterials Proceedings of Indian Geotechnical Conference 2021 Volume 1
Soil Behavior and Characterization of Geomaterials Proceedings of Indian Geotechnical Conference 2021 Volume 1
Author 
Muthukkumaran, Kasinathan. editor. Jakka, Ravi Sankar. editor. Parthasarathy, C. R. editor. Soundara, B. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-6513-5
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10. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-26708-6
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11. 
Cover image for Recent Advances in Materials Processing and Characterization Select Proceedings of ICMPC 2021
Recent Advances in Materials Processing and Characterization Select Proceedings of ICMPC 2021
Author 
Arockiarajan, A. editor. Duraiselvam, M. editor. Raju, Ramesh. editor. Reddy, N. Subba. editor. Satyanarayana, K. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-5347-7
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12. 
Cover image for Artificial Intelligence in Education. Posters and Late Breaking Results, Workshops and Tutorials, Industry and Innovation Tracks, Practitioners, Doctoral Consortium and Blue Sky 24th International Conference, AIED 2023, Tokyo, Japan, July 3-7, 2023, Proceedings
Artificial Intelligence in Education. Posters and Late Breaking Results, Workshops and Tutorials, Industry and Innovation Tracks, Practitioners, Doctoral Consortium and Blue Sky 24th International Conference, AIED 2023, Tokyo, Japan, July 3-7, 2023, Proceedings
Author 
Wang, Ning. editor. Rebolledo-Mendez, Genaro. editor. Dimitrova, Vania. editor. Matsuda, Noboru. editor. Santos, Olga C. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-36336-8
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