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1. 
Cover image for Contactless VLSI Measurement and Testing Techniques
Contactless VLSI Measurement and Testing Techniques
Author 
Sayil, Selahattin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69673-7
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2. 
Cover image for Fundamentals of Electrical Circuit Analysis
Fundamentals of Electrical Circuit Analysis
Author 
Salam, Md. Abdus. author. Rahman, Quazi Mehbubar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8624-3
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3. 
Cover image for Adapted Compressed Sensing for Effective Hardware Implementations A Design Flow for Signal-Level Optimization of Compressed Sensing Stages
Adapted Compressed Sensing for Effective Hardware Implementations A Design Flow for Signal-Level Optimization of Compressed Sensing Stages
Author 
Mangia, Mauro. author. Pareschi, Fabio. author. Cambareri, Valerio. author. Rovatti, Riccardo. author. Setti, Gianluca. author.
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https://doi.org/10.1007/978-3-319-61373-4
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4. 
Cover image for Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Author 
Anguera, Jaume. editor. Satapathy, Suresh Chandra. editor. Bhateja, Vikrant. editor. Sunitha, K.V.N. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-7329-8
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5. 
Cover image for MEMS Lorentz Force Magnetometers From Specifications to Product
MEMS Lorentz Force Magnetometers From Specifications to Product
Author 
Buffa, Cesare. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-59412-5
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6. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58175-0
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7. 
Cover image for High-Resolution and High-Speed Integrated CMOS AD Converters for Low-Power Applications
High-Resolution and High-Speed Integrated CMOS AD Converters for Low-Power Applications
Author 
Li, Weitao. author. Li, Fule. author. Wang, Zhihua. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-62012-1
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8. 
Cover image for Semiconductor Power Devices Physics, Characteristics, Reliability
Semiconductor Power Devices Physics, Characteristics, Reliability
Author 
Lutz, Josef. author. Schlangenotto, Heinrich. author. Scheuermann, Uwe. author. De Doncker, Rik. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70917-8
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9. 
Cover image for Handheld Total Chemical and Biological Analysis Systems Bridging NMR, Digital Microfluidics, and Semiconductors
Handheld Total Chemical and Biological Analysis Systems Bridging NMR, Digital Microfluidics, and Semiconductors
Author 
Lei, Ka-Meng. author. Mak, Pui-In. author. Law, Man-Kay. author. Martins, Rui Paulo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-67825-2
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10. 
Cover image for Coexistence of IMT-Advanced Systems for Spectrum Sharing with FSS Receivers in C-Band and Extended C-Band
Coexistence of IMT-Advanced Systems for Spectrum Sharing with FSS Receivers in C-Band and Extended C-Band
Author 
Abdulrazak, Lway Faisal. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70588-0
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11. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
Author 
Lienig, Jens. author. Thiele, Matthias. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-73558-0
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12. 
Cover image for Machine Learning for Model Order Reduction
Machine Learning for Model Order Reduction
Author 
Mohamed, Khaled Salah. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75714-8
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