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49. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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50. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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51. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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52. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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53. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19131-2
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54. 
Cover image for Fundamentals of Superconducting Nanoelectronics
Fundamentals of Superconducting Nanoelectronics
Author 
Sidorenko, Anatolie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20158-5
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55. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1638-9
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56. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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57. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
Author 
Yu, Peter Y. author. Cardona, Manuel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-00710-1
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58. 
Cover image for Zinc Oxide From Fundamental Properties Towards Novel Applications
Zinc Oxide From Fundamental Properties Towards Novel Applications
Author 
Klingshirn, Claus F. author. Meyer, Bruno K. author. Waag, Andreas. author. Hoffmann, Axel. author. Geurts, Jean. author.
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http://dx.doi.org/10.1007/978-3-642-10577-7
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59. 
Cover image for Laser Processing of Materials Fundamentals, Applications and Developments
Laser Processing of Materials Fundamentals, Applications and Developments
Author 
Schaaf, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-13281-0
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60. 
Cover image for Nanoscience and Engineering in Superconductivity
Nanoscience and Engineering in Superconductivity
Author 
Moshchalkov, Victor. editor. Woerdenweber, Roger. editor. Lang, Wolfgang. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15137-8
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