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49. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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50. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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51. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1638-9
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52. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19131-2
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53. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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54. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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55. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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56. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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57. 
Cover image for Global Life Cycle Impact Assessments of Material Shifts The Example of a Lead-free Electronics Industry
Global Life Cycle Impact Assessments of Material Shifts The Example of a Lead-free Electronics Industry
Author 
Andrae, A.S.G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-661-8
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58. 
Cover image for Advances in Polaron Physics
Advances in Polaron Physics
Author 
Alexandrov, Alexandre S. author. Devreese, Jozef T. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-01896-1
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59. 
Cover image for Subwavelength and Nanometer Diameter Optical Fibers
Subwavelength and Nanometer Diameter Optical Fibers
Author 
Tong, Limin. author. Sumetsky, Michael. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-03362-9
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60. 
Cover image for Introduction to the Physics of Diluted Magnetic Semiconductors
Introduction to the Physics of Diluted Magnetic Semiconductors
Author 
Gaj, Jan A. editor. Kossut, Jacek. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15856-8
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