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49. 
Cover image for Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Author 
Pardo, Lorena. author. Ricote, Jesús. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-90-481-2875-4
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50. 
Cover image for Strain Effect in Semiconductors Theory and Device Applications
Strain Effect in Semiconductors Theory and Device Applications
Author 
Sun, Yongke. author. Thompson, Scott E. author. Nishida, Toshikazu. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0552-9
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51. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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52. 
Cover image for Nanoscale Photonics and Optoelectronics Science and Technology
Nanoscale Photonics and Optoelectronics Science and Technology
Author 
Wang, Zhiming M. editor. Neogi, Arup. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7587-4
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53. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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54. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
Author 
Yu, Peter Y. author. Cardona, Manuel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-00710-1
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55. 
Cover image for Solid-State Physics Introduction to the Theory
Solid-State Physics Introduction to the Theory
Author 
Patterson, James. author. Bailey, Bernard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02589-1
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56. 
Cover image for Cellular Nanoscale Sensory Wave Computing
Cellular Nanoscale Sensory Wave Computing
Author 
Baatar, Chagaan. editor. Porod, Wolfgang. editor. Roska, Tamás. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1011-0
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57. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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58. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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59. 
Cover image for Copper Interconnect Technology
Copper Interconnect Technology
Author 
Gupta, Tapan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0076-0
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60. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-79394-8
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