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1. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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2. 
Cover image for Analysis and Design of Networks-on-Chip Under High Process Variation
Analysis and Design of Networks-on-Chip Under High Process Variation
Author 
Ezz-Eldin, Rabab. author. El-Moursy, Magdy Ali. author. Hamed, Hesham F. A. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-25766-2
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3. 
Cover image for Sensing Technology: Current Status and Future Trends IV
Sensing Technology: Current Status and Future Trends IV
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12898-6
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4. 
Cover image for Quadrature Frequency Generation for Wideband Wireless Applications
Quadrature Frequency Generation for Wideband Wireless Applications
Author 
Elbadry, Mohammad. author. Harjani, Ramesh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-13788-9
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5. 
Cover image for Dynamic Memory Management for Embedded Systems
Dynamic Memory Management for Embedded Systems
Author 
Atienza Alonso, David. author. Mamagkakis, Stylianos. author. Poucet, Christophe. author. Peón-Quirós, Miguel. author. Bartzas, Alexandros. author.
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https://doi.org/10.1007/978-3-319-10572-7
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6. 
Cover image for CMOS Continuous-Time Adaptive Equalizers for High-Speed Serial Links
CMOS Continuous-Time Adaptive Equalizers for High-Speed Serial Links
Author 
Gimeno Gasca, Cecilia. author. Celma Pueyo, Santiago. author. Aldea Chagoyen, Concepción. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-10563-5
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7. 
Cover image for The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
Author 
Ab. Hamid, Khairuddin. editor. Ono, Osamu. editor. Bostamam, Anas Muhamad. editor. Poh Ai Ling, Amy. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54439-5
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8. 
Cover image for Low Power Interconnect Design
Low Power Interconnect Design
Author 
Saini, Sandeep. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-1323-3
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9. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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10. 
Cover image for Theory and Applications of Applied Electromagnetics APPEIC 2014
Theory and Applications of Applied Electromagnetics APPEIC 2014
Author 
Sulaiman, Hamzah Asyrani. editor. Othman, Mohd Azlishah. editor. Abd. Aziz, Mohamad Zoinol Abidin. editor. Abd Malek, Mohd Fareq. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17269-9
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11. 
Cover image for Alternating Current Multi-Circuit Electric Machines A New Approach to the Steady-State Parameter Determination
Alternating Current Multi-Circuit Electric Machines A New Approach to the Steady-State Parameter Determination
Author 
Asanbayev, Valentin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-10109-5
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12. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07611-9
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