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1. 
Cover image for Oscillating Heat Pipes
Oscillating Heat Pipes
Author 
Ma, Hongbin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2504-9
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2. 
Cover image for Thermal-Hydraulic Analysis of Nuclear Reactors
Thermal-Hydraulic Analysis of Nuclear Reactors
Author 
Zohuri, Bahman. author. Fathi, Nima. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-17434-1
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3. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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4. 
Cover image for Critical Heat Flux in Flow Boiling in Microchannels
Critical Heat Flux in Flow Boiling in Microchannels
Author 
Saha, Sujoy Kumar. author. Celata, Gian Piero. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-17735-9
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5. 
Cover image for Thermal Effects in Supercapacitors
Thermal Effects in Supercapacitors
Author 
Xiong, Guoping. author. Kundu, Arpan. author. Fisher, Timothy S. author. SpringerLink (Online service)
Preferred Shelf Number 
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https://doi.org/10.1007/978-3-319-20242-6
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6. 
Cover image for Thermal Integrity in Mechanics and Engineering
Thermal Integrity in Mechanics and Engineering
Author 
Shorr, Boris F. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-46968-2
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7. 
Cover image for Developments in the Flow of Complex Fluids in Tubes
Developments in the Flow of Complex Fluids in Tubes
Author 
Siginer, Dennis A. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-02426-4
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8. 
Cover image for Design for Micro-Combined Cooling, Heating and Power Systems Stirling Engines and Renewable Power Systems
Design for Micro-Combined Cooling, Heating and Power Systems Stirling Engines and Renewable Power Systems
Author 
Badea, Nicolae. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4471-6254-4
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9. 
Cover image for Heat Transfer Modeling An Inductive Approach
Heat Transfer Modeling An Inductive Approach
Author 
Sidebotham, George. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-14514-3
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10. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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11. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2581-0
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12. 
Cover image for Analytical Methods for Heat Transfer and Fluid Flow Problems
Analytical Methods for Heat Transfer and Fluid Flow Problems
Author 
Weigand, Bernhard. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-662-46593-6
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