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49. 
Cover image for Electronics in advanced research industries : industry 4.0 to industry 5.0 advances
Electronics in advanced research industries : industry 4.0 to industry 5.0 advances
Author 
Massaro, Alessandro, 1974- author.
Preferred Shelf Number 
T59.6 .M37 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119716907
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50. 
Cover image for Multi-processor system-on-chip. 2, Applications
Multi-processor system-on-chip. 2, Applications
Author 
Andrade, Liliana, editor. Rousseau, Frédéric, 1967- editor.
Preferred Shelf Number 
TK7895 .E42
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119818410
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51. 
Cover image for Embedded Systems Design with Special Arithmetic and Number Systems
Embedded Systems Design with Special Arithmetic and Number Systems
Author 
Molahosseini, Amir Sabbagh. editor. de Sousa, Leonel Seabra. editor. (orcid)0000-0002-8066-221X Chang, Chip-Hong. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49742-6
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52. 
Cover image for Embedded Software Verification and Debugging
Embedded Software Verification and Debugging
Author 
Lettnin, Djones. editor. Winterholer, Markus. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-2266-2
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53. 
Cover image for Scaling OpenMP for Exascale Performance and Portability 13th International Workshop on OpenMP, IWOMP 2017, Stony Brook, NY, USA, September 20-22, 2017, Proceedings
Scaling OpenMP for Exascale Performance and Portability 13th International Workshop on OpenMP, IWOMP 2017, Stony Brook, NY, USA, September 20-22, 2017, Proceedings
Author 
de Supinski, Bronis R. editor. Olivier, Stephen L. editor. Terboven, Christian. editor. Chapman, Barbara M. editor. Müller, Matthias S. editor.
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ONLINE
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https://doi.org/10.1007/978-3-319-65578-9
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54. 
Cover image for Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Author 
Posser, Gracieli. author. Sapatnekar, Sachin S. author. Reis, Ricardo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-48899-8
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55. 
Cover image for Introduction to Logic Circuits & Logic Design with VHDL
Introduction to Logic Circuits & Logic Design with VHDL
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-34195-8
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56. 
Cover image for Task Scheduling for Multi-core and Parallel Architectures Challenges, Solutions and Perspectives
Task Scheduling for Multi-core and Parallel Architectures Challenges, Solutions and Perspectives
Author 
Chen, Quan. author. Guo, Minyi. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-6238-4
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57. 
Cover image for VLSI Design and Test 21st International Symposium, VDAT 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers
VLSI Design and Test 21st International Symposium, VDAT 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers
Author 
Kaushik, Brajesh Kumar. editor. Dasgupta, Sudeb. editor. Singh, Virendra. editor. (orcid)0000-0002-9113-5167 SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-7470-7
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58. 
Cover image for Fuzzy Logic Based Power-Efficient Real-Time Multi-Core System
Fuzzy Logic Based Power-Efficient Real-Time Multi-Core System
Author 
Ahmed, Jameel. author. Siyal, Mohammed Yakoob. author. Najam, Shaheryar. author. Najam, Zohaib. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-3120-5
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59. 
Cover image for The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era
The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era
Author 
Rahmani, Amir M. editor. Liljeberg, Pasi. editor. Hemani, Ahmed. editor. Jantsch, Axel. editor. Tenhunen, Hannu. editor.
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ONLINE
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https://doi.org/10.1007/978-3-319-31596-6
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60. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-52548-8
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