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1. 
Cover image for Advances in Material Science and Engineering Selected Articles from ICMMPE 2022
Advances in Material Science and Engineering Selected Articles from ICMMPE 2022
Author 
Awang, Mokhtar. editor. Al-Kayiem, Hussain H. editor. Bor, Ton C. editor. (orcid)0000-0003-1173-1186 Emamian, Seyed Sattar. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-5318-9
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2. 
Cover image for Advances in Material Science and Engineering Selected articles from ICMMPE 2023, 16-Nov, Putrajaya, Malaysia
Advances in Material Science and Engineering Selected articles from ICMMPE 2023, 16-Nov, Putrajaya, Malaysia
Author 
Emamian, Sattar S. editor. (orcid)0000-0001-5488-4217 Awang, Mokhtar. editor. Al-Kayiem, Hussain H. editor. (orcid)0000-0002-6045-8553 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2015-6
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3. 
Cover image for 3GPP-based non-terrestrial networks in 5G and 6G : expanding the frontiers of wireless communications
3GPP-based non-terrestrial networks in 5G and 6G : expanding the frontiers of wireless communications
Author 
Tripathi, Nishith D., author. Reed, Jeffrey Hugh, author.
Preferred Shelf Number 
TK5104 .T75 2026
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394203413
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4. 
Cover image for Navigating technology and national security : the intersection of CFIUS, Team Telecom, AI controls, and other regulations
Navigating technology and national security : the intersection of CFIUS, Team Telecom, AI controls, and other regulations
Author 
Sherman, Justin, author.
Preferred Shelf Number 
KF1976 .S54 2026
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394332991
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5. 
Cover image for Teknoloji transfer sözleşmeleri
Teknoloji transfer sözleşmeleri
Author 
Yıldız Arslan, Melike.
Preferred Shelf Number 
K1530 Y553 2025
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6. 
Cover image for Molecular and Biotechnological Tools for Plant Disease Management
Molecular and Biotechnological Tools for Plant Disease Management
Author 
Chen, Jen-Tsung. editor. Khan, Masudulla. editor. Parveen, Aiman. editor. Patra, Jayanta Kumar. editor. (orcid)0000-0003-4118-4355 SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-97-7510-1
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7. 
Cover image for Proceedings of Fluid Mechanics and Fluid Power (FMFP) 2023, Vol. 1 Fluid Mechanics
Proceedings of Fluid Mechanics and Fluid Power (FMFP) 2023, Vol. 1 Fluid Mechanics
Author 
Kothadia, Hardik. editor. Arun, K. R. editor. Rajesh, G. editor. (orcid)0000-0003-4518-9727 Arakeri, Jaywant H. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-6776-2
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8. 
Cover image for Smart Innovation in Mechanical Engineering Select Proceedings of ICOME 2023, 30-31 August, Bali, Indonesia
Smart Innovation in Mechanical Engineering Select Proceedings of ICOME 2023, 30-31 August, Bali, Indonesia
Author 
El Kharbachi, Abdel. editor. Wijayanti, Ika Dewi. editor. Suwarta, Putu. editor. Tolj, Ivan. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-97-7898-0
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9. 
Cover image for Proceedings of Fluid Mechanics and Fluid Power (FMFP) 2023, Vol. 2 Fluid Dynamics
Proceedings of Fluid Mechanics and Fluid Power (FMFP) 2023, Vol. 2 Fluid Dynamics
Author 
Kothadia, Hardik. editor. Arun, K. R. editor. Rajesh, G. editor. (orcid)0000-0003-4518-9727 Arakeri, Jaywant H. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-6783-0
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10. 
Cover image for Smart Computing Paradigms: Advanced Data Mining and Analytics Proceedings of Sixth International Conference on Smart Computing and Informatics (SCI 2024), Volume 2
Smart Computing Paradigms: Advanced Data Mining and Analytics Proceedings of Sixth International Conference on Smart Computing and Informatics (SCI 2024), Volume 2
Author 
Simic, Milan. editor. Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Azar, Ahmad Taher. editor. Lydia, E. Laxmi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-1981-8
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11. 
Cover image for Agro-Waste Management and Valorization.
Agro-Waste Management and Valorization.
Author 
Agrawal, Pratibha S. Agrawal, Pratibha S./Tiwari, Rich. Belkhode, Pramod N.
Preferred Shelf Number 
XX(600394.1)
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527854226
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12. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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