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49. 
Cover image for Electronics in advanced research industries : industry 4.0 to industry 5.0 advances
Electronics in advanced research industries : industry 4.0 to industry 5.0 advances
Author 
Massaro, Alessandro, 1974- author.
Preferred Shelf Number 
T59.6 .M37 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119716907
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50. 
Cover image for Multi-processor system-on-chip. 2, Applications
Multi-processor system-on-chip. 2, Applications
Author 
Andrade, Liliana, editor. Rousseau, Frédéric, 1967- editor.
Preferred Shelf Number 
TK7895 .E42
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119818410
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51. 
Cover image for Embedded Software Verification and Debugging
Embedded Software Verification and Debugging
Author 
Lettnin, Djones. editor. Winterholer, Markus. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-2266-2
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52. 
Cover image for Scaling OpenMP for Exascale Performance and Portability 13th International Workshop on OpenMP, IWOMP 2017, Stony Brook, NY, USA, September 20-22, 2017, Proceedings
Scaling OpenMP for Exascale Performance and Portability 13th International Workshop on OpenMP, IWOMP 2017, Stony Brook, NY, USA, September 20-22, 2017, Proceedings
Author 
de Supinski, Bronis R. editor. Olivier, Stephen L. editor. Terboven, Christian. editor. Chapman, Barbara M. editor. Müller, Matthias S. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-65578-9
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53. 
Cover image for Green IT Engineering: Concepts, Models, Complex Systems Architectures
Green IT Engineering: Concepts, Models, Complex Systems Architectures
Author 
Kharchenko, Vyacheslav. editor. Kondratenko, Yuriy. editor. Kacprzyk, Janusz. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44162-7
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54. 
Cover image for Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Author 
Posser, Gracieli. author. Sapatnekar, Sachin S. author. Reis, Ricardo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-48899-8
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55. 
Cover image for Introduction to Logic Circuits & Logic Design with VHDL
Introduction to Logic Circuits & Logic Design with VHDL
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-34195-8
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56. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-52548-8
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57. 
Cover image for Hardware IP Security and Trust
Hardware IP Security and Trust
Author 
Mishra, Prabhat. editor. Bhunia, Swarup. editor. Tehranipoor, Mark. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49025-0
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58. 
Cover image for Foundations of Hardware IP Protection
Foundations of Hardware IP Protection
Author 
Bossuet, Lilian. editor. Torres, Lionel. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50380-6
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59. 
Cover image for Fundamentals of IP and SoC Security Design, Verification, and Debug
Fundamentals of IP and SoC Security Design, Verification, and Debug
Author 
Bhunia, Swarup. editor. Ray, Sandip. editor. Sur-Kolay, Susmita. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50057-7
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60. 
Cover image for Internet of Things Building Blocks and Business Models
Internet of Things Building Blocks and Business Models
Author 
Hussain, Fatima. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-55405-1
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