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1. 
Cover image for Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2016
Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2016
Author 
Fummi, Franco. editor. Wille, Robert. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-62920-9
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2. 
Cover image for Automated Validation & Verification of UML/OCL Models Using Satisfiability Solvers
Automated Validation & Verification of UML/OCL Models Using Satisfiability Solvers
Author 
Przigoda, Nils. author. Wille, Robert. author. Przigoda, Judith. author. Drechsler, Rolf. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-72814-8
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3. 
Cover image for Fundamentals of Electrical Circuit Analysis
Fundamentals of Electrical Circuit Analysis
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Salam, Md. Abdus. author. Rahman, Quazi Mehbubar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8624-3
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4. 
Cover image for Digital Storage in Consumer Electronics The Essential Guide
Digital Storage in Consumer Electronics The Essential Guide
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Coughlin, Thomas M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69907-3
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5. 
Cover image for Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
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Anguera, Jaume. editor. Satapathy, Suresh Chandra. editor. Bhateja, Vikrant. editor. Sunitha, K.V.N. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-7329-8
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6. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58175-0
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7. 
Cover image for Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Author 
Yang, Gi-Chul. editor. Ao, Sio-Iong. editor. Huang, Xu. editor. Castillo, Oscar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9588-3
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8. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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9. 
Cover image for Piezo-Electric Electro-Acoustic Transducers
Piezo-Electric Electro-Acoustic Transducers
Author 
Sharapov, Valeriy. author. Sotula, Zhanna. author. Kunickaya, Larisa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01198-1
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10. 
Cover image for MEMS-based Circuits and Systems for Wireless Communication
MEMS-based Circuits and Systems for Wireless Communication
Author 
Enz, Christian C. editor. Kaiser, Andreas. editor. SpringerLink (Online service)
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ONLINE(330847.1)
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http://dx.doi.org/10.1007/978-1-4419-8798-3
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11. 
Cover image for Design and Testing of Digital Microfluidic Biochips
Design and Testing of Digital Microfluidic Biochips
Author 
Zhao, Yang. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
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ONLINE(331239.1)
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http://dx.doi.org/10.1007/978-1-4614-0370-8
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12. 
Cover image for Fast Hopping Frequency Generation in Digital CMOS
Fast Hopping Frequency Generation in Digital CMOS
Author 
Farazian, Mohammad. author. Larson, Lawrence E. author. Gudem, Prasad S. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0490-3
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