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1. 
Cover image for 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
Author 
Li, Simon. author. Fu, Yue. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0481-1
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2. 
Cover image for High Performance Fiber Reinforced Cement Composites 6 HPFRCC 6
High Performance Fiber Reinforced Cement Composites 6 HPFRCC 6
Author 
Parra-Montesinos, Gustavo J. editor. Reinhardt, Hans W. editor. Naaman, A. E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-2436-5
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3. 
Cover image for All-Embracing Manufacturing Roadmap System
All-Embracing Manufacturing Roadmap System
Author 
Halevi, Gideon. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-4180-5
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4. 
Cover image for Reliability of Nanoscale Circuits and Systems Methodologies and Circuit Architectures
Reliability of Nanoscale Circuits and Systems Methodologies and Circuit Architectures
Author 
Stanisavljević, Miloš. author. Schmid, Alexandre. author. Leblebici, Yusuf. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6217-1
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5. 
Cover image for Multiprocessor System-on-Chip Hardware Design and Tool Integration
Multiprocessor System-on-Chip Hardware Design and Tool Integration
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Hübner, Michael. editor. Becker, Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6460-1
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6. 
Cover image for Focal-Plane Sensor-Processor Chips
Focal-Plane Sensor-Processor Chips
Author 
Zarándy, Ákos. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6475-5
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7. 
Cover image for Dependability in Electronic Systems Mitigation of Hardware Failures, Soft Errors, and Electro-Magnetic Disturbances
Dependability in Electronic Systems Mitigation of Hardware Failures, Soft Errors, and Electro-Magnetic Disturbances
Author 
Kanekawa, Nobuyasu. author. Ibe, Eishi H. author. Suga, Takashi. author. Uematsu, Yutaka. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6715-2
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8. 
Cover image for Ultra Low-Power Integrated Circuit Design for Wireless Neural Interfaces
Ultra Low-Power Integrated Circuit Design for Wireless Neural Interfaces
Author 
Holleman, Jeremy. author. Zhang, Fan. author. Otis, Brian. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6727-5
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9. 
Cover image for Design and Analysis of Biomolecular Circuits Engineering Approaches to Systems and Synthetic Biology
Design and Analysis of Biomolecular Circuits Engineering Approaches to Systems and Synthetic Biology
Author 
Koeppl, Heinz. editor. Setti, Gianluca. editor. di Bernardo, Mario. editor. Densmore, Douglas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6766-4
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10. 
Cover image for Wearable Monitoring Systems
Wearable Monitoring Systems
Author 
Bonfiglio, Annalisa. editor. De Rossi, Danilo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7384-9
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11. 
Cover image for Run-time Adaptation for Reconfigurable Embedded Processors
Run-time Adaptation for Reconfigurable Embedded Processors
Author 
Bauer, Lars. author. Henkel, Jörg. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7412-9
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12. 
Cover image for Low-Power Variation-Tolerant Design in Nanometer Silicon
Low-Power Variation-Tolerant Design in Nanometer Silicon
Author 
Bhunia, Swarup. editor. Mukhopadhyay, Saibal. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7418-1
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