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1. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-94-007-1229-4
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2. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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3. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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4. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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5. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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6. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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7. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1638-9
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8. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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9. 
Cover image for POWER/HVMOS Devices Compact Modeling
POWER/HVMOS Devices Compact Modeling
Author 
Grabinski, Wladyslaw. editor. Gneiting, Thomas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-3046-7
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10. 
Cover image for Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Author 
Fulde, Michael. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-3280-5
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11. 
Cover image for Global Life Cycle Impact Assessments of Material Shifts The Example of a Lead-free Electronics Industry
Global Life Cycle Impact Assessments of Material Shifts The Example of a Lead-free Electronics Industry
Author 
Andrae, A.S.G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-661-8
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12. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
Author 
Yu, Peter Y. author. Cardona, Manuel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-00710-1
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