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49. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-79394-8
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50. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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51. 
Cover image for Integrated Optics Theory and Technology
Integrated Optics Theory and Technology
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Hunsperger, Robert G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b98730
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52. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
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Razeghi, Manijeh. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-92168-6
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53. 
Cover image for The Materials Science of Semiconductors
The Materials Science of Semiconductors
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Rockett, Angus. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68650-9
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54. 
Cover image for Transparent Electronics
Transparent Electronics
Author 
Wager, John F. author. Keszler, Douglas A. author. Presley, Rick E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-72342-6
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55. 
Cover image for Polarization Effects in Semiconductors From Ab InitioTheory to Device Applications
Polarization Effects in Semiconductors From Ab InitioTheory to Device Applications
Author 
Wood, Colin. editor. Jena, Debdeep. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68319-5
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56. 
Cover image for Nanoscale Phenomena Basic Science to Device Applications
Nanoscale Phenomena Basic Science to Device Applications
Author 
Tang, Zikang. editor. Sheng, Ping. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-73048-6
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57. 
Cover image for Nanoelectronics and Photonics From Atoms to Materials, Devices, and Architectures
Nanoelectronics and Photonics From Atoms to Materials, Devices, and Architectures
Author 
Korkin, Anatoli. editor. Rosei, Federico. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76499-3
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58. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
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Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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59. 
Cover image for Piezoelectric and Acoustic Materials for Transducer Applications
Piezoelectric and Acoustic Materials for Transducer Applications
Author 
Safari, Ahmad. editor. Akdoğan, E. Koray. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76540-2
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60. 
Cover image for Piezoelectric Transducers and Applications
Piezoelectric Transducers and Applications
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Vives, Antonio Arnau. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77508-9
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