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49. 
Cover image for Advanced Analysis of Nontraditional Machining
Advanced Analysis of Nontraditional Machining
Author 
Hocheng, Hong. editor. Tsai, Hung-Yin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331418.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4054-3
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50. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331478.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4337-7
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51. 
Cover image for Laser-Assisted Fabrication of Materials
Laser-Assisted Fabrication of Materials
Author 
Majumdar, Jyotsna Dutta. editor. Manna, Indranil. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333178.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28359-8
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52. 
Cover image for Handbook of Technical Diagnostics Fundamentals and Application to Structures and Systems
Handbook of Technical Diagnostics Fundamentals and Application to Structures and Systems
Author 
Czichos, Horst. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333141.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-25850-3
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53. 
Cover image for Acoustic Scanning Probe Microscopy
Acoustic Scanning Probe Microscopy
Author 
Marinello, Francesco. editor. Passeri, Daniele. editor. Savio, Enrico. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333153.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-27494-7
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54. 
Cover image for Energy Level Alignment and Electron Transport Through Metal/Organic Contacts From Interfaces to Molecular Electronics
Energy Level Alignment and Electron Transport Through Metal/Organic Contacts From Interfaces to Molecular Electronics
Author 
Abad, Enrique. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333371.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-30907-6
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55. 
Cover image for Sintering Mechanisms of Convention Nanodensification and Field Assisted Processes
Sintering Mechanisms of Convention Nanodensification and Field Assisted Processes
Author 
Castro, Ricardo. editor. Benthem, Klaus. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333383.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-31009-6
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56. 
Cover image for Transition-Metal Defects in Silicon New Insights from Photoluminescence Studies of Highly Enriched 28Si
Transition-Metal Defects in Silicon New Insights from Photoluminescence Studies of Highly Enriched 28Si
Author 
Steger, Michael. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333931.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-35079-5
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57. 
Cover image for Resonance Effects of Excitons and Electrons Basics and Applications
Resonance Effects of Excitons and Electrons Basics and Applications
Author 
Geru, Ion. author. Suter, Dieter. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334053.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-35807-4
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58. 
Cover image for Introduction to Thin Film Transistors Physics and Technology of TFTs
Introduction to Thin Film Transistors Physics and Technology of TFTs
Author 
Brotherton, S.D. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332657.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00002-2
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59. 
Cover image for Ultrathin Metal Transparent Electrodes for the Optoelectronics Industry
Ultrathin Metal Transparent Electrodes for the Optoelectronics Industry
Author 
Ghosh, Dhriti Sundar. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332727.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00348-1
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60. 
Cover image for Factors Governing Tin Whisker Growth
Factors Governing Tin Whisker Growth
Author 
Crandall, Erika R. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332756.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00470-9
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