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49. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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50. 
Cover image for Progress in adhesion and adhesives. Volume 4
Progress in adhesion and adhesives. Volume 4
Author 
Mittal, K. L., 1945- editor.
Preferred Shelf Number 
TP968
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119625322
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51. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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52. 
Cover image for From Variability Tolerance to Approximate Computing in Parallel Integrated Architectures and Accelerators
From Variability Tolerance to Approximate Computing in Parallel Integrated Architectures and Accelerators
Author 
Rahimi, Abbas. author. Benini, Luca. author. Gupta, Rajesh K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-53768-9
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53. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-52548-8
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54. 
Cover image for Secure System Design and Trustable Computing
Secure System Design and Trustable Computing
Author 
Chang, Chip-Hong. editor. Potkonjak, Miodrag. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-14971-4
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55. 
Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Author 
Voyiadjis, George Z. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5589-9
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56. 
Cover image for Adhesion in microelectronics
Adhesion in microelectronics
Author 
Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.
Preferred Shelf Number 
ONLINE(341844.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373
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57. 
Cover image for Adhesion measurement of films and coatings. Volume 2
Adhesion measurement of films and coatings. Volume 2
Author 
Mittal, Kash L., 1945- editor. Taylor and Francis.
Preferred Shelf Number 
QC183
Electronic Access 
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58. 
Cover image for MEMS : fundamental technology and applications
MEMS : fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7875 .M457 2013
Electronic Access 
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59. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
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60. 
Cover image for Fundamentals and applications of ultrasonic waves
Fundamentals and applications of ultrasonic waves
Author 
Cheeke, J. David N., author.
Preferred Shelf Number 
QC244 .C47 2012
Electronic Access 
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