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1. 
Cover image for Handbook of frozen food processing and packaging
Handbook of frozen food processing and packaging
Author 
Sun, Da-Wen.
Preferred Shelf Number 
TP372.3 .H36 2012
Electronic Access 
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2. 
Cover image for Solar module packaging : polymeric requirements and selection
Solar module packaging : polymeric requirements and selection
Author 
Poliskie, Michelle., author.
Preferred Shelf Number 
TK2960 .P65 2011
Electronic Access 
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3. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
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4. 
Cover image for Handbook of frozen food packaging and processing
Handbook of frozen food packaging and processing
Author 
Sun, Da-Wen.
Preferred Shelf Number 
TP372.3 .H36 2005
Electronic Access 
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5. 
Cover image for Quality control of packaging materials in the pharmaceutical industry
Quality control of packaging materials in the pharmaceutical industry
Author 
Harburn, Kenneth, 1947-
Preferred Shelf Number 
RS159.5 .H37 1990
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781482206838
Taylor & Francis https://www.taylorfrancis.com/books/9780367803940
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
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7. 
Cover image for Biobased Packaging Materials Sustainable Alternative to Conventional Packaging Materials
Biobased Packaging Materials Sustainable Alternative to Conventional Packaging Materials
Author 
Ahmed, Shakeel. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-6050-7
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8. 
Cover image for Food Process Engineering and Technology Safety, Packaging, Nanotechnologies and Human Health
Food Process Engineering and Technology Safety, Packaging, Nanotechnologies and Human Health
Author 
Malik, Junaid Ahmad. editor. Goyal, Megh R. editor. Kumari, Anu. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-6831-2
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9. 
Cover image for Advances in Graphic Communication, Printing and Packaging Proceedings of 2018 9th China Academic Conference on Printing and Packaging
Advances in Graphic Communication, Printing and Packaging Proceedings of 2018 9th China Academic Conference on Printing and Packaging
Author 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3663-8
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10. 
Cover image for Biscuit, cookie and cracker production : process, production and packaging equipment
Biscuit, cookie and cracker production : process, production and packaging equipment
Author 
Davidson, Iain, author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780128155790
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11. 
Cover image for Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Author 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-7629-9
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12. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-77872-3
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