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1. 
Cover image for Packaging technology fundamentals, materials and processes
Packaging technology fundamentals, materials and processes
Author 
Emblem, Anne. Emblem, Henry.
Preferred Shelf Number 
ONLINE(313043.1)
Electronic Access 
Knovel http://app.knovel.com/hotlink/toc/id:kpPTFMP001/packaging-technology
Knovel http://app.knovel.com/web/toc.v/cid:kpPTFMP001
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2. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
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3. 
Cover image for Modified atmosphere and active packaging technologies
Modified atmosphere and active packaging technologies
Author 
Arvanitoyannis, Ioannis.
Preferred Shelf Number 
TP374 .M59 2012
Electronic Access 
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4. 
Cover image for Food and beverage packaging technology
Food and beverage packaging technology
Author 
Kirwan, Mark J.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781444392180
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=675208
ebrary http://site.ebrary.com/id/10510323
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5. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
Preferred Shelf Number 
TK7870.15 .J56 2011
Electronic Access 
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6. 
Cover image for Global legislation for food packaging materials
Global legislation for food packaging materials
Author 
Rijk, Rinus. Veraart, Rob.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://onlinelibrary.wiley.com/book/10.1002/9783527630059
John Wiley http://dx.doi.org/10.1002/9783527630059
http://site.ebrary.com/lib/alltitles/Doc?id=10383609
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7. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0984-8
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8. 
Cover image for Packaging life cultures of the everyday
Packaging life cultures of the everyday
Author 
Nayar, Pramod K.
Preferred Shelf Number 
ONLINE(369012.1)
Electronic Access 
SAGE knowledge http://sk.sagepub.com/books/packaging-life
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9. 
Cover image for Nanopackaging Nanotechnologies and Electronics Packaging
Nanopackaging Nanotechnologies and Electronics Packaging
Author 
Morris, James E. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47325-3
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10. 
Cover image for Packaging for nonthermal processing of food
Packaging for nonthermal processing of food
Author 
Han, Jung H. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0802/2006036529-b.html
John Wiley http://dx.doi.org/10.1002/9780470277720
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11. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
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12. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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