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1. 
Cover image for Composites materials for food packaging
Composites materials for food packaging
Author 
Cirillo, Giuseppe, 1980- editor. Kozlowski, Marek A., 1945- editor. Spizzirri, Umile Gianfranco, editor.
Preferred Shelf Number 
TP374 .C66 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119160243
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2. 
Cover image for Packaging for nonthermal processing of food
Packaging for nonthermal processing of food
Author 
Pascall, Melvin, 1954- editor. Han, Jung H., editor.
Preferred Shelf Number 
TP374 .P328 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119126881
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3. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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4. 
Cover image for Packaging yourself : the targeted resume
Packaging yourself : the targeted resume
Author 
Wendleton, Kate, author. Five O'Clock Club (New York, N.Y.), issuing body.
Preferred Shelf Number 
ONLINE(341070.1)
Electronic Access 
Available for Hacettepe University via Gale Virtual Reference Library. Click here to access
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5. 
Cover image for Food packaging procedures, management, and trends
Food packaging procedures, management, and trends
Author 
Kontominas, Michael, editor of compilation.
Preferred Shelf Number 
ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=535197
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6. 
Cover image for Packaging technology fundamentals, materials and processes
Packaging technology fundamentals, materials and processes
Author 
Emblem, Anne. Emblem, Henry.
Preferred Shelf Number 
ONLINE(313043.1)
Electronic Access 
Knovel http://app.knovel.com/hotlink/toc/id:kpPTFMP001/packaging-technology
Knovel http://app.knovel.com/web/toc.v/cid:kpPTFMP001
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7. 
Cover image for Modified atmosphere and active packaging technologies
Modified atmosphere and active packaging technologies
Author 
Arvanitoyannis, Ioannis.
Preferred Shelf Number 
TP374 .M59 2012
Electronic Access 
Click here to view.
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8. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
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9. 
Cover image for Food and beverage packaging technology
Food and beverage packaging technology
Author 
Kirwan, Mark J.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781444392180
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=675208
ebrary http://site.ebrary.com/id/10510323
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10. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
Preferred Shelf Number 
TK7870.15 .J56 2011
Electronic Access 
Click here to view.
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11. 
Cover image for Global legislation for food packaging materials
Global legislation for food packaging materials
Author 
Rijk, Rinus. Veraart, Rob.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://onlinelibrary.wiley.com/book/10.1002/9783527630059
John Wiley http://dx.doi.org/10.1002/9783527630059
http://site.ebrary.com/lib/alltitles/Doc?id=10383609
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12. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0984-8
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