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49. 
Cover image for Fault-Tolerant Design
Fault-Tolerant Design
Author 
Dubrova, Elena. author. SpringerLink (Online service)
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ONLINE(331297.1)
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http://dx.doi.org/10.1007/978-1-4614-2113-9
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50. 
Cover image for Requirements Engineering and Management for Software Development Projects
Requirements Engineering and Management for Software Development Projects
Author 
Chemuturi, Murali. author. SpringerLink (Online service)
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ONLINE(331756.1)
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http://dx.doi.org/10.1007/978-1-4614-5377-2
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51. 
Cover image for Parallel Computing Technologies 12th International Conference, PaCT 2013, St. Petersburg, Russia, September 30 - October 4, 2013. Proceedings
Parallel Computing Technologies 12th International Conference, PaCT 2013, St. Petersburg, Russia, September 30 - October 4, 2013. Proceedings
Author 
Malyshkin, Victor. editor. SpringerLink (Online service)
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ONLINE(334871.1)
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http://dx.doi.org/10.1007/978-3-642-39958-9
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52. 
Cover image for Energy Minimization Methods in Computer Vision and Pattern Recognition 9th International Conference, EMMCVPR 2013, Lund, Sweden, August 19-21, 2013. Proceedings
Energy Minimization Methods in Computer Vision and Pattern Recognition 9th International Conference, EMMCVPR 2013, Lund, Sweden, August 19-21, 2013. Proceedings
Author 
Heyden, Anders. editor. Kahl, Fredrik. editor. Olsson, Carl. editor. Oskarsson, Magnus. editor. Tai, Xue-Cheng. editor.
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ONLINE(334939.1)
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http://dx.doi.org/10.1007/978-3-642-40395-8
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53. 
Cover image for Computer Engineering and Technology 17th CCF Conference, NCCET 2013, Xining, China, July 20-22, 2013. Revised Selected Papers
Computer Engineering and Technology 17th CCF Conference, NCCET 2013, Xining, China, July 20-22, 2013. Revised Selected Papers
Author 
Xu, Weixia. editor. Xiao, Liquan. editor. Zhang, Chengyi. editor. Li, Jinwen. editor. Yu, Liyan. editor.
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ONLINE(335131.1)
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http://dx.doi.org/10.1007/978-3-642-41635-4
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54. 
Cover image for Computer Performance Optimization Systems - Applications - Processes
Computer Performance Optimization Systems - Applications - Processes
Author 
Osterhage, Wolfgang W. author. SpringerLink (Online service)
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ONLINE(333281.1)
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55. 
Cover image for Computer Engineering and Technology 16th National Conference, NCCET 2012, Shanghai, China, August 17-19, 2012, Revised Selected Papers
Computer Engineering and Technology 16th National Conference, NCCET 2012, Shanghai, China, August 17-19, 2012, Revised Selected Papers
Author 
Xu, Weixia. editor. Xiao, Liquan. editor. Lu, Pingjing. editor. Li, Jinwen. editor. Zhang, Chengyi. editor.
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ONLINE(334080.1)
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http://dx.doi.org/10.1007/978-3-642-35898-2
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56. 
Cover image for Tools for High Performance Computing 2012
Tools for High Performance Computing 2012
Author 
Cheptsov, Alexey. editor. Brinkmann, Steffen. editor. Gracia, José. editor. Resch, Michael M. editor. Nagel, Wolfgang E. editor.
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ONLINE(334411.1)
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57. 
Cover image for Supercomputing 28th International Supercomputing Conference, ISC 2013, Leipzig, Germany, June 16-20, 2013. Proceedings
Supercomputing 28th International Supercomputing Conference, ISC 2013, Leipzig, Germany, June 16-20, 2013. Proceedings
Author 
Kunkel, Julian Martin. editor. Ludwig, Thomas. editor. Meuer, Hans Werner. editor. SpringerLink (Online service)
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ONLINE(334662.1)
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http://dx.doi.org/10.1007/978-3-642-38750-0
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58. 
Cover image for Innovative Technologies for Dependable OTS-Based Critical Systems Challenges and Achievements of the CRITICAL STEP Project
Innovative Technologies for Dependable OTS-Based Critical Systems Challenges and Achievements of the CRITICAL STEP Project
Author 
Cotroneo, Domenico. editor. SpringerLink (Online service)
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ONLINE(335577.1)
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http://dx.doi.org/10.1007/978-88-470-2772-5
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59. 
Cover image for Design, Analysis and Test of Logic Circuits Under Uncertainty
Design, Analysis and Test of Logic Circuits Under Uncertainty
Author 
Krishnaswamy, Smita. author. Markov, Igor L. author. Hayes, John P. author. SpringerLink (Online service)
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ONLINE(335669.1)
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http://dx.doi.org/10.1007/978-90-481-9644-9
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60. 
Cover image for Semiconductor packaging materials interaction and reliability
Semiconductor packaging materials interaction and reliability
Author 
Chen, Andrea. Lo, Randy.
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