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49. 
Cover image for Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Author 
Valle, Maurizio. editor. (orcid)0000-0002-7366-6060 Gastaldo, Paolo. editor. (orcid)0000-0002-5748-3942 Limiti, Ernesto. editor. (orcid)0000-0003-4668-7461 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71518-1
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50. 
Cover image for Lecture Notes in Analog Electronics Testing and Diagnosis of Analog and Mixed-Signal Electronic Circuits
Lecture Notes in Analog Electronics Testing and Diagnosis of Analog and Mixed-Signal Electronic Circuits
Author 
Litovski, Vančo B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8257-4
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51. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume II
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume II
Author 
Jia, Limin. editor. Liu, Yi. editor. (orcid)0000-0001-9481-2429 Xu, Zhihong. editor. Tang, Longfei. editor. Song, Kai. editor.
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https://doi.org/10.1007/978-981-96-2042-5
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52. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VIII
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VIII
Author 
Sha, Aimin. editor. Yang, Ming. editor. Cai, Li. editor. Hu, Changbin. editor. Li, Rui. editor.
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https://doi.org/10.1007/978-981-96-1868-2
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53. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VII
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VII
Author 
Sha, Aimin. editor. Liu, Zhigang. editor. Wang, Xiaojun. editor. Xiao, Qian. editor. Zang, Yiming. editor.
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https://doi.org/10.1007/978-981-96-1864-4
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54. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume IV
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume IV
Author 
Jia, Limin. editor. Lv, Yanling. editor. Yang, Qiang. editor. (orcid)0000-0002-0761-4692 Xiong, Liansong. editor. Sun, Dongyang. editor.
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https://doi.org/10.1007/978-981-96-2050-0
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55. 
Cover image for Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Author 
Siarry, Patrick. editor. (orcid)0000-0002-5722-4115 Jabbar, M. A. editor. Cheung, Simon King Sing. editor. (orcid)0000-0002-7323-0961 Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2409-6
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56. 
Cover image for Fully-Integrated Low-Dropout Regulators
Fully-Integrated Low-Dropout Regulators
Author 
Mao, Xiangyu. author. (orcid)0000-0001-6530-8311 Lu, Yan. author. Martins, Rui P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-84916-9
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57. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VII
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4675-3
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58. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4787-3
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59. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume IX
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume IX
Author 
Yang, Qingxin. editor. Zhu, Chunbo. editor. Xia, Chenyang. editor. Li, Yang. editor. Luo, Zhichao. editor.
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https://doi.org/10.1007/978-981-96-4800-9
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60. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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