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49. 
Cover image for Parasitic Substrate Coupling in High Voltage Integrated Circuits Minority and Majority Carriers Propagation in Semiconductor Substrate
Parasitic Substrate Coupling in High Voltage Integrated Circuits Minority and Majority Carriers Propagation in Semiconductor Substrate
Author 
Buccella, Pietro. author. Stefanucci, Camillo. author. Kayal, Maher. author. Sallese, Jean-Michel. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-74382-0
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50. 
Cover image for Embedded System Design Embedded Systems Foundations of Cyber-Physical Systems, and the Internet of Things
Embedded System Design Embedded Systems Foundations of Cyber-Physical Systems, and the Internet of Things
Author 
Marwedel, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-56045-8
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51. 
Cover image for Dependable Multicore Architectures at Nanoscale
Dependable Multicore Architectures at Nanoscale
Author 
Ottavi, Marco. editor. Gizopoulos, Dimitris. editor. Pontarelli, Salvatore. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-54422-9
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52. 
Cover image for Tantalum and Niobium-Based Capacitors Science, Technology, and Applications
Tantalum and Niobium-Based Capacitors Science, Technology, and Applications
Author 
Freeman, Yuri. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-67870-2
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53. 
Cover image for Formal System Verification State-of the-Art and Future Trends
Formal System Verification State-of the-Art and Future Trends
Author 
Drechsler, Rolf. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-57685-5
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54. 
Cover image for Energy Efficient Embedded Video Processing Systems A Hardware-Software Collaborative Approach
Energy Efficient Embedded Video Processing Systems A Hardware-Software Collaborative Approach
Author 
Khan, Muhammad Usman Karim. author. Shafique, Muhammad. author. Henkel, Jörg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-61455-7
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55. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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56. 
Cover image for Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Author 
Yang, Gi-Chul. editor. Ao, Sio-Iong. editor. Huang, Xu. editor. Castillo, Oscar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9588-3
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57. 
Cover image for Piezo-Electric Electro-Acoustic Transducers
Piezo-Electric Electro-Acoustic Transducers
Author 
Sharapov, Valeriy. author. Sotula, Zhanna. author. Kunickaya, Larisa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01198-1
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58. 
Cover image for Constraining Designs for Synthesis and Timing Analysis A Practical Guide to Synopsys Design Constraints (SDC)
Constraining Designs for Synthesis and Timing Analysis A Practical Guide to Synopsys Design Constraints (SDC)
Author 
Gangadharan, Sridhar. author. Churiwala, Sanjay. author. SpringerLink (Online service)
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ONLINE(331327.1)
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http://dx.doi.org/10.1007/978-1-4614-3269-2
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59. 
Cover image for SRAM Design for Wireless Sensor Networks Energy Efficient and Variability Resilient Techniques
SRAM Design for Wireless Sensor Networks Energy Efficient and Variability Resilient Techniques
Author 
Sharma, Vibhu. author. Catthoor, Francky. author. Dehaene, Wim. author. SpringerLink (Online service)
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ONLINE(331415.1)
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http://dx.doi.org/10.1007/978-1-4614-4039-0
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60. 
Cover image for Mobility-based Time References for Wireless Sensor Networks
Mobility-based Time References for Wireless Sensor Networks
Author 
Sebastiano, Fabio. author. Breems, Lucien J. author. Makinwa, Kofi A. A. author. SpringerLink (Online service)
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ONLINE(331344.1)
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http://dx.doi.org/10.1007/978-1-4614-3483-2
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