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49. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-7091-0778-2
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50. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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51. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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52. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1638-9
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53. 
Cover image for Fundamentals of Superconducting Nanoelectronics
Fundamentals of Superconducting Nanoelectronics
Author 
Sidorenko, Anatolie. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-20158-5
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54. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19131-2
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55. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19489-4
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56. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1229-4
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57. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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58. 
Cover image for Metamaterials Theory, Design, and Applications
Metamaterials Theory, Design, and Applications
Author 
Cui, Tie Jun. editor. Smith, David. editor. Liu, Ruopeng. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0573-4
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59. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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60. 
Cover image for Nanotechnology for Electronics, Photonics, and Renewable Energy
Nanotechnology for Electronics, Photonics, and Renewable Energy
Author 
Korkin, Anatoli. editor. Krstić, Predrag S. editor. Wells, Jack C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7454-9
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