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49. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Author 
Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0055-8
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50. 
Cover image for Introduction to Mechatronics An Integrated Approach
Introduction to Mechatronics An Integrated Approach
Author 
Samanta, Biswanath. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29320-7
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51. 
Cover image for Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems ICCCES 2022
Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems ICCCES 2022
Author 
Bindhu, V. editor. Tavares, João Manuel R. S. editor. Vuppalapati, Chandrasekar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7753-4
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52. 
Cover image for The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
Author 
Ma, Chengbin. editor. Zhang, Yiming. editor. Li, Siqi. editor. Zhao, Lei. editor. Liu, Ming. editor.
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https://doi.org/10.1007/978-981-99-0631-4
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53. 
Cover image for Multi-component force sensing systems
Multi-component force sensing systems
Author 
Liang, Qiaokang, author.
Preferred Shelf Number 
TJ213 .L53 2021
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003052531
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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54. 
Cover image for VLSI Design and Test for Systems Dependability
VLSI Design and Test for Systems Dependability
Author 
Asai, Shojiro. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-56594-9
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55. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-93683-3
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56. 
Cover image for Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Author 
Hu, Kai. author. Chakrabarty, Krishnendu. author. Ho, Tsung-Yi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-56255-1
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57. 
Cover image for PLD Based Design with VHDL RTL Design, Synthesis and Implementation
PLD Based Design with VHDL RTL Design, Synthesis and Implementation
Author 
Taraate, Vaibbhav. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-3296-7
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58. 
Cover image for High-Speed Decoders for Polar Codes
High-Speed Decoders for Polar Codes
Author 
Giard, Pascal. author. Thibeault, Claude. author. Gross, Warren J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-59782-9
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59. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-51697-4
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60. 
Cover image for Reconstruction, Identification and Implementation Methods for Spiking Neural Circuits
Reconstruction, Identification and Implementation Methods for Spiking Neural Circuits
Author 
Florescu, Dorian. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-57081-5
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