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49. 
Cover image for Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Author 
Triwiyanto, Triwiyanto. editor. Rizal, Achmad. editor. Caesarendra, Wahyu. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-99-0248-4
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50. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7636-0
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51. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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52. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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53. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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54. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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55. 
Cover image for Basic Electronic Circuits Problems and Solutions
Basic Electronic Circuits Problems and Solutions
Author 
Vasudevan, K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09363-0
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56. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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57. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0451-8
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58. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0915-5
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59. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11224-9
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60. 
Cover image for Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Author 
Qin, Jiahu. author. Wan, Yanni. author. Li, Fangyuan. author. Kang, Yu. author. Fu, Weiming. author.
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https://doi.org/10.1007/978-981-19-8594-2
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