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49. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06764-3
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50. 
Cover image for Dynamic Memory Management for Embedded Systems
Dynamic Memory Management for Embedded Systems
Author 
Atienza Alonso, David. author. Mamagkakis, Stylianos. author. Poucet, Christophe. author. Peón-Quirós, Miguel. author. Bartzas, Alexandros. author.
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https://doi.org/10.1007/978-3-319-10572-7
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51. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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52. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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53. 
Cover image for Radio Systems Engineering A Tutorial Approach
Radio Systems Engineering A Tutorial Approach
Author 
De Los Santos, Héctor J. author. Sturm, Christian. author. Pontes, Juan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07326-2
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54. 
Cover image for Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Author 
Gupta, Somsubhra. editor. Bag, Sandip. editor. Ganguly, Karabi. editor. Sarkar, Indranath. editor. Biswas, Papun. editor.
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https://doi.org/10.1007/978-81-322-2256-9
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55. 
Cover image for CMOS Test and Evaluation A Physical Perspective
CMOS Test and Evaluation A Physical Perspective
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1349-7
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56. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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57. 
Cover image for Radio Frequency Propagation Made Easy
Radio Frequency Propagation Made Easy
Author 
Faruque, Saleh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-11394-4
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58. 
Cover image for Theory and Applications of Applied Electromagnetics APPEIC 2014
Theory and Applications of Applied Electromagnetics APPEIC 2014
Author 
Sulaiman, Hamzah Asyrani. editor. Othman, Mohd Azlishah. editor. Abd. Aziz, Mohamad Zoinol Abidin. editor. Abd Malek, Mohd Fareq. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17269-9
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59. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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60. 
Cover image for More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
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Topaloglu, Rasit O. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2163-8
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