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1. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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2. 
Cover image for Circuit Design on Plastic Foils
Circuit Design on Plastic Foils
Author 
Raiteri, Daniele. author. Cantatore, Eugenio. author. van Roermund, Arthur. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-11427-9
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3. 
Cover image for Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Author 
Maharatna, Koushik. editor. Dalapati, Goutam Kumar. editor. Banerjee, P K. editor. Mallick, Amiya Kumar. editor. Mukherjee, Moumita. editor.
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https://doi.org/10.1007/978-81-322-2274-3
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4. 
Cover image for High-Performance AD and DA Converters, IC Design in Scaled Technologies, and Time-Domain Signal Processing Advances in Analog Circuit Design 2014
High-Performance AD and DA Converters, IC Design in Scaled Technologies, and Time-Domain Signal Processing Advances in Analog Circuit Design 2014
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A. A. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07938-7
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5. 
Cover image for Power-Efficient High-Speed Parallel-Sampling ADCs for Broadband Multi-carrier Systems
Power-Efficient High-Speed Parallel-Sampling ADCs for Broadband Multi-carrier Systems
Author 
Lin, Yu. author. Hegt, Hans. author. Doris, Kostas. author. van Roermund, Arthur H.M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17680-2
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6. 
Cover image for Microarchitecture of Network-on-Chip Routers A Designer's Perspective
Microarchitecture of Network-on-Chip Routers A Designer's Perspective
Author 
Dimitrakopoulos, Giorgos. author. Psarras, Anastasios. author. Seitanidis, Ioannis. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-4301-8
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7. 
Cover image for Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Author 
Pangracious, Vinod. author. Marrakchi, Zied. author. Mehrez, Habib. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-19174-4
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8. 
Cover image for Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2013
Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2013
Author 
Louërat, Marie-Minerve. editor. Maehne, Torsten. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06317-1
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9. 
Cover image for Design and Implementation of Sigma Delta Modulators (ΣΔM) for Class D Audio Amplifiers using Differential Pairs
Design and Implementation of Sigma Delta Modulators (ΣΔM) for Class D Audio Amplifiers using Differential Pairs
Author 
Pereira, Nuno. author. Paulino, Nuno. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-11638-9
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10. 
Cover image for A Digital Phase Locked Loop based Signal and Symbol Recovery System for Wireless Channel
A Digital Phase Locked Loop based Signal and Symbol Recovery System for Wireless Channel
Author 
Purkayastha, Basab Bijoy. author. Sarma, Kandarpa Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2041-1
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11. 
Cover image for More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
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Topaloglu, Rasit O. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2163-8
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12. 
Cover image for Theory and Applications of Applied Electromagnetics APPEIC 2014
Theory and Applications of Applied Electromagnetics APPEIC 2014
Author 
Sulaiman, Hamzah Asyrani. editor. Othman, Mohd Azlishah. editor. Abd. Aziz, Mohamad Zoinol Abidin. editor. Abd Malek, Mohd Fareq. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17269-9
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