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49. 
Cover image for From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428299
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50. 
Cover image for From additive manufacturing to 3D/4D printing. 1, From concepts to achievements
From additive manufacturing to 3D/4D printing. 1, From concepts to achievements
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428510
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51. 
Cover image for High Sensitivity Magnetometers
High Sensitivity Magnetometers
Author 
Grosz, Asaf. editor. Haji-Sheikh, Michael J. editor. Mukhopadhyay, Subhas C. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-34070-8
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52. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-43199-4
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53. 
Cover image for Hardware Protection through Obfuscation
Hardware Protection through Obfuscation
Author 
Forte, Domenic. editor. Bhunia, Swarup. editor. Tehranipoor, Mark M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49019-9
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54. 
Cover image for Hardware IP Security and Trust
Hardware IP Security and Trust
Author 
Mishra, Prabhat. editor. Bhunia, Swarup. editor. Tehranipoor, Mark. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49025-0
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55. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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56. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
Author 
J.M. Veendrick, Harry. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-47597-4
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57. 
Cover image for Piezoelectric MEMS Resonators
Piezoelectric MEMS Resonators
Author 
Bhugra, Harmeet. editor. Piazza, Gianluca. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-28688-4
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58. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-2720-8
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59. 
Cover image for Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO : Application to Displays
Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO : Application to Displays
Author 
Yamazaki, Shunpei, editor. Tsutsui, Tetsuo, editor.
Preferred Shelf Number 
TK7871.85
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119247395
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60. 
Cover image for Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Author 
Peng, Hua-Xin. author. Qin, Faxiang. author. Phan, Manh-Huong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-29276-2
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