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1. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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2. 
Cover image for Theory and Applications of Applied Electromagnetics APPEIC 2014
Theory and Applications of Applied Electromagnetics APPEIC 2014
Author 
Sulaiman, Hamzah Asyrani. editor. Othman, Mohd Azlishah. editor. Abd. Aziz, Mohamad Zoinol Abidin. editor. Abd Malek, Mohd Fareq. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17269-9
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3. 
Cover image for Trusted Computing for Embedded Systems
Trusted Computing for Embedded Systems
Author 
Candaele, Bernard. editor. Soudris, Dimitrios. editor. Anagnostopoulos, Iraklis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09420-5
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4. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09647-6
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5. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06764-3
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6. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15407-7
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7. 
Cover image for The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
Author 
Ab. Hamid, Khairuddin. editor. Ono, Osamu. editor. Bostamam, Anas Muhamad. editor. Poh Ai Ling, Amy. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54439-5
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8. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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9. 
Cover image for Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Author 
Reynders, Nele. author. Dehaene, Wim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-16136-5
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10. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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11. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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12. 
Cover image for Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors
Author 
Hwang, Cheol Seong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8054-9
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