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49. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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50. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9176-7
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51. 
Cover image for Piezo-Electric Electro-Acoustic Transducers
Piezo-Electric Electro-Acoustic Transducers
Author 
Sharapov, Valeriy. author. Sotula, Zhanna. author. Kunickaya, Larisa. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-01198-1
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52. 
Cover image for High Permittivity Gate Dielectric Materials
High Permittivity Gate Dielectric Materials
Author 
Kar, Samares. editor. SpringerLink (Online service)
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ONLINE(334228.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36535-5
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53. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
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ONLINE(331478.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4337-7
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54. 
Cover image for Magnetic Resonance Imaging with Nonlinear Gradient Fields Signal Encoding and Image Reconstruction
Magnetic Resonance Imaging with Nonlinear Gradient Fields Signal Encoding and Image Reconstruction
Author 
Schultz, Gerrit. author. SpringerLink (Online service)
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ONLINE(335259.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-658-01134-5
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55. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27512-8
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56. 
Cover image for Adiabatic Logic Future Trend and System Level Perspective
Adiabatic Logic Future Trend and System Level Perspective
Author 
Teichmann, Philip. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-94-007-2345-0
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57. 
Cover image for Chips 2020 A Guide to the Future of Nanoelectronics
Chips 2020 A Guide to the Future of Nanoelectronics
Author 
Hoefflinger, Bernd. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-23096-7
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58. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-236-0
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59. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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60. 
Cover image for Coronal Mass Ejections An Introduction
Coronal Mass Ejections An Introduction
Author 
Howard, Timothy. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8789-1
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