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1. 
Cover image for Embedded System Design Embedded Systems Foundations of Cyber-Physical Systems, and the Internet of Things
Embedded System Design Embedded Systems Foundations of Cyber-Physical Systems, and the Internet of Things
Author 
Marwedel, Peter. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-56045-8
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2. 
Cover image for Formal System Verification State-of the-Art and Future Trends
Formal System Verification State-of the-Art and Future Trends
Author 
Drechsler, Rolf. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-57685-5
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3. 
Cover image for Energy Efficient Embedded Video Processing Systems A Hardware-Software Collaborative Approach
Energy Efficient Embedded Video Processing Systems A Hardware-Software Collaborative Approach
Author 
Khan, Muhammad Usman Karim. author. Shafique, Muhammad. author. Henkel, Jörg. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-61455-7
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4. 
Cover image for Hands-on Experience with Altera FPGA Development Boards
Hands-on Experience with Altera FPGA Development Boards
Author 
Parab, Jivan S. author. Gad, Rajendra S. author. Naik, G.M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-3769-3
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5. 
Cover image for Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Author 
Yazdani, Farhang. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75769-8
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6. 
Cover image for Inkjet-Configurable Gate Array Towards Application Specific Printed Electronic Circuits
Inkjet-Configurable Gate Array Towards Application Specific Printed Electronic Circuits
Author 
Mashayekhi, Mohammad. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-72116-3
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7. 
Cover image for Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Author 
Yang, Gi-Chul. editor. Ao, Sio-Iong. editor. Huang, Xu. editor. Castillo, Oscar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9588-3
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8. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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9. 
Cover image for Piezo-Electric Electro-Acoustic Transducers
Piezo-Electric Electro-Acoustic Transducers
Author 
Sharapov, Valeriy. author. Sotula, Zhanna. author. Kunickaya, Larisa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01198-1
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10. 
Cover image for Prüfungsfragen zur Elektronik Bachelor Ausbildung
Prüfungsfragen zur Elektronik Bachelor Ausbildung
Author 
Baumann, Peter. author. SpringerLink (Online service)
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ONLINE(338101.1)
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http://dx.doi.org/10.1007/978-3-658-02913-5
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11. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE(330808.1)
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http://dx.doi.org/10.1007/978-1-4419-5768-9
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12. 
Cover image for MEMS-based Circuits and Systems for Wireless Communication
MEMS-based Circuits and Systems for Wireless Communication
Author 
Enz, Christian C. editor. Kaiser, Andreas. editor. SpringerLink (Online service)
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ONLINE(330847.1)
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http://dx.doi.org/10.1007/978-1-4419-8798-3
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