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1. 
Cover image for Digital Storage in Consumer Electronics The Essential Guide
Digital Storage in Consumer Electronics The Essential Guide
Author 
Coughlin, Thomas M. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-69907-3
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2. 
Cover image for Memristor Technology: Synthesis and Modeling for Sensing and Security Applications
Memristor Technology: Synthesis and Modeling for Sensing and Security Applications
Author 
Abunahla, Heba. author. Mohammad, Baker. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-65699-1
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3. 
Cover image for Low Power Active Electrode ICs for Wearable EEG Acquisition
Low Power Active Electrode ICs for Wearable EEG Acquisition
Author 
Xu, Jiawei. author. Yazicioglu, Refet Firat. author. Van Hoof, Chris. author. Makinwa, Kofi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-74863-4
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4. 
Cover image for Symbolic Parallelization of Nested Loop Programs
Symbolic Parallelization of Nested Loop Programs
Author 
Tanase, Alexandru-Petru. author. Hannig, Frank. author. Teich, Jürgen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-73909-0
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5. 
Cover image for Tantalum and Niobium-Based Capacitors Science, Technology, and Applications
Tantalum and Niobium-Based Capacitors Science, Technology, and Applications
Author 
Freeman, Yuri. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-67870-2
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6. 
Cover image for Formal System Verification State-of the-Art and Future Trends
Formal System Verification State-of the-Art and Future Trends
Author 
Drechsler, Rolf. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-57685-5
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7. 
Cover image for Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Transactions on Engineering Technologies International MultiConference of Engineers and Computer Scientists 2014
Author 
Yang, Gi-Chul. editor. Ao, Sio-Iong. editor. Huang, Xu. editor. Castillo, Oscar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9588-3
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8. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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9. 
Cover image for Piezo-Electric Electro-Acoustic Transducers
Piezo-Electric Electro-Acoustic Transducers
Author 
Sharapov, Valeriy. author. Sotula, Zhanna. author. Kunickaya, Larisa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01198-1
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10. 
Cover image for Bordnetze und Powermanagement Thermische Modellbildung für elektrische und elektronische Bauelemente
Bordnetze und Powermanagement Thermische Modellbildung für elektrische und elektronische Bauelemente
Author 
Babiel, Gerhard. author. SpringerLink (Online service)
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ONLINE(337820.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-658-01559-6
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11. 
Cover image for EMV-gerechte Schirmung Magnetmaterialien für die Schirmung - Praxisbeispiele - Gerätedesign
EMV-gerechte Schirmung Magnetmaterialien für die Schirmung - Praxisbeispiele - Gerätedesign
Author 
Gräbner, Frank. author. SpringerLink (Online service)
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ONLINE(338398.1)
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http://dx.doi.org/10.1007/978-3-8348-2639-8
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12. 
Cover image for Design and Testing of Digital Microfluidic Biochips
Design and Testing of Digital Microfluidic Biochips
Author 
Zhao, Yang. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
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ONLINE(331239.1)
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http://dx.doi.org/10.1007/978-1-4614-0370-8
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