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1. 
Cover image for Advances in Integrated Design and Manufacturing in Mechanical Engineering II
Advances in Integrated Design and Manufacturing in Mechanical Engineering II
Author 
Tichkiewitch, S. editor. Tollenaere, M. editor. Ray, P. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-6761-7
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Cover image for Electromagnetic Compatibility of Integrated Circuits Techniques for low emission and susceptibility
Electromagnetic Compatibility of Integrated Circuits Techniques for low emission and susceptibility
Author 
Ben Dhia, Sonia. editor. Ramdani, Mohamed. editor. Sicard, Etienne. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137864
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Cover image for Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Author 
Kogel, Tim. author. Leupers, Rainer. author. Meyr, Heinrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4826-2
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4. 
Cover image for Reuse-Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits
Reuse-Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits
Author 
CASTRO-LÓPEZ, R. author. FERNÁNDEZ, F.V. author. GUERRA-VINUESA, O. author. RODRÍGUEZ-VÁZQUEZ, Á. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-5139-5
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5. 
Cover image for LNA-ESD Co-Design for Fully Integrated CMOS Wireless Receivers
LNA-ESD Co-Design for Fully Integrated CMOS Wireless Receivers
Author 
Leroux, Paul. author. Steyaert, Michiel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-3191-2
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6. 
Cover image for Advances in Integrated Design and Manufacturing in Mechanical Engineering
Advances in Integrated Design and Manufacturing in Mechanical Engineering
Author 
Bramley, Alan. editor. Brissaud, Daniel. editor. Coutellier, Daniel. editor. McMahon, Chris. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-3482-2
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7. 
Cover image for Integrated Risk and Vulnerability Management Assisted by Decision Support Systems Relevance and Impact on Governance
Integrated Risk and Vulnerability Management Assisted by Decision Support Systems Relevance and Impact on Governance
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Gheorghe, Adrian V. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-3721-X
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Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
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Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
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http://dx.doi.org/10.1007/978-1-4614-3160-2
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9. 
Cover image for MEMS-based Circuits and Systems for Wireless Communication
MEMS-based Circuits and Systems for Wireless Communication
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Enz, Christian C. editor. Kaiser, Andreas. editor. SpringerLink (Online service)
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ONLINE(330847.1)
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http://dx.doi.org/10.1007/978-1-4419-8798-3
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10. 
Cover image for Bio-Medical CMOS ICs
Bio-Medical CMOS ICs
Author 
Yoo, Hoi-Jun. editor. Hoof, Chris. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6597-4
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11. 
Cover image for 3D Integration for NoC-based SoC Architectures
3D Integration for NoC-based SoC Architectures
Author 
Sheibanyrad, Abbas. editor. Pétrot, Frédéric. editor. Jantsch, Axel. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7618-5
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12. 
Cover image for Nanoscale Memory Repair
Nanoscale Memory Repair
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Horiguchi, Masashi. author. Itoh, Kiyoo. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7958-2
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