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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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3. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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4. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1229-4
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5. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
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Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19131-2
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6. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19489-4
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7. 
Cover image for Fundamentals of Superconducting Nanoelectronics
Fundamentals of Superconducting Nanoelectronics
Author 
Sidorenko, Anatolie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20158-5
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8. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0778-2
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9. 
Cover image for Strain Effect in Semiconductors Theory and Device Applications
Strain Effect in Semiconductors Theory and Device Applications
Author 
Sun, Yongke. author. Thompson, Scott E. author. Nishida, Toshikazu. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0552-9
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10. 
Cover image for Metamaterials Theory, Design, and Applications
Metamaterials Theory, Design, and Applications
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Cui, Tie Jun. editor. Smith, David. editor. Liu, Ruopeng. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0573-4
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11. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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12. 
Cover image for Cellular Nanoscale Sensory Wave Computing
Cellular Nanoscale Sensory Wave Computing
Author 
Baatar, Chagaan. editor. Porod, Wolfgang. editor. Roska, Tamás. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1011-0
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