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73. 
Cover image for Graphs in VLSI
Graphs in VLSI
Author 
Bairamkulov, Rassul. author. Friedman, Eby G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11047-4
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74. 
Cover image for Proceedings of Second International Conference on Computational Electronics for Wireless Communications ICCWC 2022
Proceedings of Second International Conference on Computational Electronics for Wireless Communications ICCWC 2022
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Rawat, Sanyog. editor. Kumar, Sandeep. editor. Kumar, Pramod. editor. Anguera, Jaume. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-6661-3
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75. 
Cover image for Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
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Manetakis, Konstantinos. author. SpringerLink (Online service)
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76. 
Cover image for Advances in Data-driven Computing and Intelligent Systems Selected Papers from ADCIS 2022, Volume 2
Advances in Data-driven Computing and Intelligent Systems Selected Papers from ADCIS 2022, Volume 2
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Das, Swagatam. editor. Saha, Snehanshu. editor. Coello Coello, Carlos A. editor. Bansal, Jagdish Chand. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0981-0
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77. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
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Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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78. 
Cover image for Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Microelectronics, Circuits and Systems Select Proceedings of Micro2021
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Biswas, Abhijit. editor. Islam, Aminul. editor. Chaujar, Rishu. editor. Jaksic, Olga. editor. SpringerLink (Online service)
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79. 
Cover image for Engineering Design A Survival Guide to Senior Capstone
Engineering Design A Survival Guide to Senior Capstone
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Mettler, Cory J. author. SpringerLink (Online service)
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80. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
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Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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81. 
Cover image for VLSI, Communication and Signal Processing Select Proceedings of the 5th International Conference, VCAS 2022
VLSI, Communication and Signal Processing Select Proceedings of the 5th International Conference, VCAS 2022
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Nagaria, R. K. editor. Tripathi, V. S. editor. Zamarreno, Carlos Ruiz. editor. Prajapati, Yogendra Kumar. editor. SpringerLink (Online service)
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82. 
Cover image for Antenna Technology for Terahertz Wireless Communication
Antenna Technology for Terahertz Wireless Communication
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Nissanov, Uri. author. Singh, Ghanshyam. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-35900-2
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83. 
Cover image for Analog and Mixed-Signal Circuits in Nanoscale CMOS
Analog and Mixed-Signal Circuits in Nanoscale CMOS
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Paulo da Silva Martins, Rui. editor. Mak, Pui-In. editor. SpringerLink (Online service)
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84. 
Cover image for Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
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Chakravarthy, V.V.S.S.S. editor. Bhateja, Vikrant. editor. Flores Fuentes, Wendy. editor. Anguera, Jaume. editor. Vasavi, K. Padma. editor.
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