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Cover image for Developments in Design Research and Practice II Best Papers from the 11th Senses and Sensibility 2021: Designing Next Genera(c)tions
Developments in Design Research and Practice II Best Papers from the 11th Senses and Sensibility 2021: Designing Next Genera(c)tions
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Duarte, Emilia. editor. (orcid)0000-0002-1932-9098 Di Roma, Annalisa. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-32280-8
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Cover image for Advances in Design and Digital Communication III Proceedings of the 6th International Conference on Design and Digital Communication, Digicom 2022, November 3-5, 2022, Barcelos, Portugal
Advances in Design and Digital Communication III Proceedings of the 6th International Conference on Design and Digital Communication, Digicom 2022, November 3-5, 2022, Barcelos, Portugal
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Martins, Nuno. editor. Brandão, Daniel. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20364-0
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Cover image for Future Automotive Production Conference 2022
Future Automotive Production Conference 2022
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Dröder, Klaus. editor. Vietor, Thomas. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-39928-3
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Cover image for Sensing Technology Proceedings of ICST'15
Sensing Technology Proceedings of ICST'15
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Suryadevara, Nagender Kumar. editor. George, Boby. editor. Jayasundera, Krishanthi P. editor. Mukhopadhyay, Subhas Chandra. editor. SpringerLink (Online service)
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Cover image for Prediction Technologies for Improving Engineering Product Efficiency
Prediction Technologies for Improving Engineering Product Efficiency
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Klyatis, Lev M. author. SpringerLink (Online service)
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Cover image for Seismic Isolation, Energy Dissipation and Active Vibration Control of Structures 17th World Conference on Seismic Isolation (17WCSI)
Seismic Isolation, Energy Dissipation and Active Vibration Control of Structures 17th World Conference on Seismic Isolation (17WCSI)
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Cimellaro, Gian Paolo. editor. (orcid)0000-0001-6474-3493 SpringerLink (Online service)
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Cover image for Fungi and Fungal Products in Human Welfare and Biotechnology
Fungi and Fungal Products in Human Welfare and Biotechnology
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Satyanarayana, Tulasi. editor. Deshmukh, Sunil Kumar. editor. SpringerLink (Online service)
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Cover image for Digital Twin Development An Introduction to Simcenter Amesim
Digital Twin Development An Introduction to Simcenter Amesim
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Rückert, Frank U. author. Sauer, Michael. author. Liimatainen, Tuomo. author. Hübner, Dirk. author. SpringerLink (Online service)
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Cover image for From Industry 4.0 to Industry 5.0 Mapping the Transitions
From Industry 4.0 to Industry 5.0 Mapping the Transitions
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Hamdan, Allam. editor. Harraf, Arezou. editor. Buallay, Amina. editor. Arora, Pallvi. editor. Alsabatin, Hala. editor.
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Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
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Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-1906-0
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Cover image for Low Cost Manufacturing Technologies Proceedings of NERC 2022
Low Cost Manufacturing Technologies Proceedings of NERC 2022
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Joshi, Shrikrishna Nandkishor. editor. Dixit, Uday Shanker. editor. Mittal, R. K. editor. Bag, Swarup. editor. SpringerLink (Online service)
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Cover image for Advanced Theory and Applications of Engineering Systems Under the Framework of Industry 4.0 Proceedings of 2022 International Conference on Intelligent Systems Design and Engineering Applications
Advanced Theory and Applications of Engineering Systems Under the Framework of Industry 4.0 Proceedings of 2022 International Conference on Intelligent Systems Design and Engineering Applications
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Ma, Yongsheng. editor. SpringerLink (Online service)
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