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1. 
Cover image for EMERGING TRENDS IN INDUSTRIAL ENGINEERING AND MANAGEMENT
EMERGING TRENDS IN INDUSTRIAL ENGINEERING AND MANAGEMENT
Preferred Shelf Number 
T56
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003512585
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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Cover image for Industrial engineering strategy for constructive technologies : a systems-based approach for the global economy
Industrial engineering strategy for constructive technologies : a systems-based approach for the global economy
Author 
Badiru, Adedeji Bodunde, 1952- author.
Preferred Shelf Number 
TA168
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781032659220
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Cover image for Smart factories for industry 5.0 transformation
Smart factories for industry 5.0 transformation
Author 
Nidhya, R., editor. Kumar, Manish. Karthik, S. Anand, Rishabh. Balamurugan, S.
Preferred Shelf Number 
T59.6 .S63 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394200467
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Cover image for Advances in artificial intelligence applications in industrial and systems engineering
Advances in artificial intelligence applications in industrial and systems engineering
Author 
Salvendy, Gavriel, 1938- editor. Karwowski, Waldemar, 1953- editor. Duffy, Vincent G. editor http://id.loc.gov/authorities/names/nb2007019323
Preferred Shelf Number 
TA347 .A78 A3856 2025
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394257096
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Cover image for Process downtime reduction : how to minimize waste from breakdowns, set-ups, supply chain issues, and staffing constraints
Process downtime reduction : how to minimize waste from breakdowns, set-ups, supply chain issues, and staffing constraints
Author 
Beauregard, Michael R., author.
Preferred Shelf Number 
T58.8
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003372714
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Cover image for Manufacturing system throughput excellence : analysis, improvement, and design
Manufacturing system throughput excellence : analysis, improvement, and design
Author 
Tang, He (Herman), author. John Wiley & Sons, publisher.
Preferred Shelf Number 
TS156.8 .T365 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394190355
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7. 
Cover image for Methodical Development of Modular Product Families Developing High Product Diversity in a Manageable Way
Methodical Development of Modular Product Families Developing High Product Diversity in a Manageable Way
Author 
Krause, Dieter. author. Gebhardt, Nicolas. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-662-65680-8
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Cover image for Materials, Design and Manufacturing for Sustainable Environment Select Proceedings of ICMDMSE 2022
Materials, Design and Manufacturing for Sustainable Environment Select Proceedings of ICMDMSE 2022
Author 
Natarajan, Elango. editor. Vinodh, S. editor. Rajkumar, V. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-3053-9
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9. 
Cover image for Company Controlling
Company Controlling
Author 
Behúnová, Annamaria. author. Knapcikova, Lucia. author. (orcid)0000-0003-1925-4038 Behún, Marcel. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-13153-0
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10. 
Cover image for Prediction Technologies for Improving Engineering Product Efficiency
Prediction Technologies for Improving Engineering Product Efficiency
Author 
Klyatis, Lev M. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-16655-6
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11. 
Cover image for Accidents and Disasters Lessons from Air Crashes and Pandemics
Accidents and Disasters Lessons from Air Crashes and Pandemics
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Chandra, Satish. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-9984-0
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12. 
Cover image for Data-Driven Scheduling of Semiconductor Manufacturing Systems
Data-Driven Scheduling of Semiconductor Manufacturing Systems
Author 
Li, Li. author. Yu, Qingyun. author. Lin, Kuo-Yi. author. Ma, Yumin. author. Qiao, Fei. author.
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https://doi.org/10.1007/978-981-19-7588-2
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