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1. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-79394-8
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2. 
Cover image for Metamaterials and Plasmonics: Fundamentals, Modelling, Applications
Metamaterials and Plasmonics: Fundamentals, Modelling, Applications
Author 
Zouhdi, Saïd. editor. Sihvola, Ari. editor. Vinogradov, Alexey P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9407-1
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3. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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4. 
Cover image for Porous Semiconductors Optical Properties and Applications
Porous Semiconductors Optical Properties and Applications
Author 
Kochergin, Vladimir. author. Föll, Helmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-578-9
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5. 
Cover image for Crystal Growth of Si for Solar Cells
Crystal Growth of Si for Solar Cells
Author 
Nakajima, Kazuo. editor. Usami, Noritaka. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02044-5
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6. 
Cover image for Extended Defects in Germanium Fundamental and Technological Aspects
Extended Defects in Germanium Fundamental and Technological Aspects
Author 
Claeys, Cor. editor. Simoen, Eddy. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-85614-6
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7. 
Cover image for Low Pressure Plasmas and Microstructuring Technology
Low Pressure Plasmas and Microstructuring Technology
Author 
Franz, Gerhard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-85849-2
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8. 
Cover image for Oxide and Nitride Semiconductors Processing, Properties, and Applications
Oxide and Nitride Semiconductors Processing, Properties, and Applications
Author 
Yao, Takafumi. editor. Hong, Soon-Ku. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-88847-5
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9. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78219-5
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10. 
Cover image for Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Author 
Seebauer, Edmund G. author. Kratzer, Meredith C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-059-3
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11. 
Cover image for Nanoscale Magnetic Materials and Applications
Nanoscale Magnetic Materials and Applications
Author 
Liu, J. Ping. editor. Fullerton, Eric. editor. Gutfleisch, Oliver. editor. Sellmyer, D.J. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85600-1
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